A clear RFQ package helps a custom thick film circuit supplier respond with a useful engineering answer instead of a rough price. The same outline size can require very different processes depending on substrate, resistor value, heater power, conductor system, tolerance, and operating environment.
Use this checklist when requesting a quote for thick film PCB, ceramic circuit board, printed resistor, sensor resistor, thick film heater, or hybrid ceramic substrate projects.
Minimum RFQ information
- Drawing files: PDF, DXF, DWG, Gerber, STEP, or clear sample photos.
- Product function: resistor, sensor track, heater, conductor substrate, hybrid circuit, or assembly interface.
- Substrate: alumina, AlN, stainless steel, aluminum, PI, FR4, or unknown material to be reviewed.
- Finished dimensions, thickness, holes, slots, edge profile, and mounting constraints.
- Electrical data: resistance value, tolerance, curve, TCR, voltage, current, power, and insulation requirement.
- Process needs: screen printing, firing, laser trimming, metallized holes, solder pads, wire bonding pads, or coating.
- Environment: temperature, humidity, vibration, fuel, oil, chemicals, thermal cycling, or outdoor exposure.
- Quantity: prototype, small batch, annual volume, target lead time, and packaging requirement.
When to include extra data
For fuel level sensors, include resistance versus angle or float position. For throttle position sensors, include travel range, contact path, and output curve. For heaters, include voltage, wattage, target temperature, heat-up time, and housing structure. For hybrid substrates, include die attach, wire bonding, soldering, and coating requirements.
Quality expectations
State whether the project requires resistance report, visual inspection criteria, insulation test, dielectric withstand, adhesion test, thermal cycling, humidity test, PPAP-style documentation, SPC control, or lot traceability. These requirements affect process planning and quotation accuracy.