Flexible resistive position element

PI Flexible Position Sensor

PI flexible position sensors place printed resistive and conductor functions on a thin polyimide film for compact feedback assemblies. Chipsimple reviews the sensing path, response curve, contact or wiper interface, bend condition, terminals, electrical loading, environment, and lifecycle test together before a custom sensor element is released.

  • Thin PI format for constrained assemblies
  • Custom resistive and collector-track artwork
  • Curve and contact mechanics reviewed together
  • Bend, termination, and lifecycle by project
PIFlexible substrate route
≥5×Static bend-radius reference
5Verified product views
By curveResponse release basis

Quick Specifications

The values below are flexible and polymer thick film selection references. PI grade, thickness, artwork, film build, cure, resistance, response curve, bend condition, termination, and operating window are narrowed through the sensor drawing, mating mechanics, electrical circuit, and validation method.

Final values confirmed against customer drawing.

Substrate MaterialPI / PET / PEN / Polycarbonate
Substrate Thickness25–250 µm typical
Conductor SystemAg / Ag-C / Carbon
Resistor SystemCarbon / Ag-C / PTC
Printed Film Thickness8–12 µm typical
Cure Temperature120–150°C typical
Minimum Line/Space≥150 µm typical
Printed Layers1–4 layers typical
Minimum Bend Radius≥5 × substrate thickness, static
Operating Temperature-40 to +90°C typical
Resistance Tolerance±5% / ±10% typical
TerminationPad / Crimp / Connector / Conductive adhesive

Engineering Capabilities

A useful PI position-sensor review starts with the complete measurement chain. Track geometry, resistance range, collector path, mating contact, travel, contact force, electrical loading, film support, connector, calibration, environment, and expected movement duty must agree before artwork and inspection limits are released.

Sensing-track architecture

Release the resistive path, collector conductors, terminal fingers, overlaps, active travel, inactive margins, and any protective windows as controlled artwork tied to the required output behavior.

Curve and travel definition

Provide the resistance or voltage curve against position, direction, measurement points, tolerance or linearity, loading, stabilization condition, and calibration method used by the complete sensor.

Contact and flex interface

Define wiper material, shape, force, travel, speed, alignment, film support, bend radius, connector, and housing so contact stability is evaluated in the real mechanism.

Validation and traceability

Dimensional fit, resistance, curve output, continuity, contact noise, wear, adhesion, temperature, humidity, vibration, and lot records are selected to match project risk and duty.

Typical Applications

Flexible printed position elements can fit curved or space-limited mechanisms, but the sensor output remains dependent on mating mechanics, electronics, support, contamination control, and calibration.

View all applications

Verified Product Views

The verified photographs show thin PI-format sensor strips, printed dark sensing regions, conductor paths, terminal fingers, and both flat and curved presentation. They do not prove resistance range, output curve, linearity, contact noise, bend endurance, temperature capability, or completed-sensor calibration.

Controlled detail crop of a verified PI flexible position sensor with a long printed sensing track and terminals
Printed sensing-track detail
Visible format
Thin flexible strips, printed tracks, conductors, and terminal regions are directly visible.
Curve boundary
A photograph cannot establish resistance, voltage output, linearity, travel, direction, or calibration.
Contact boundary
Wiper material, force, alignment, lubrication, wear, and contact-noise limits are defined with the mating assembly.
Flex boundary
Static bend and dynamic movement duty require the released support condition and validation plan.

Manufacturing & Quality

Chipsimple supports controlled printing, laboratory inspection, production management, and protected packing in Dongguan. PI sensor projects release the film and ink set, sensing artwork, curve test, contact conditions, sampling, traceability, and acceptance criteria together; finished-sensor performance is validated with the customer mechanism and electronics.

View Full Capabilities
Chipsimple screen-printing workshop with controlled printing stations
Controlled Printing
Chipsimple laboratory for dimensional and electrical inspection
Laboratory Inspection
Chipsimple production site in Yonglida Tiansheng High-tech Industry Park
Dongguan Production Site
Chipsimple protected packing area for released thick film products
Protected Packing

Technical FAQ

Short answers for quotation planning; released drawings and validation requirements remain controlling.

What should be defined first for a custom PI Flexible Position Sensor?

Define active travel or angle, the required resistance or voltage curve, tolerance or linearity, direction, measurement points, loading, mating contact, force, speed, movement duty, film support, bend radius, terminal interface, operating environment, and calibration. A sample photo alone cannot release a repeatable position-sensor design.

Are the quick specification values guaranteed for every design?

No. They are practical category-level selection values, not a released product specification. Material compatibility, geometry, print build, electrical loading, assembly, environment, inspection method, and expected volume can narrow the usable window. Final values are confirmed against the controlled drawing and approved project conditions.

How should PI Flexible Position Sensor performance be validated?

Use the sensor's real contact and support to verify dimensional fit, resistance or voltage output across travel, repeatability, hysteresis if applicable, contact noise, wear, temperature, humidity, vibration, and any contamination exposure. Test current, speed, force, conditioning, sample size, and acceptance limits must be controlled.

What should be included with an RFQ?

Send the controlled drawing or artwork, dimensions and tolerances, material preference, electrical targets, assembly interface, operating environment, validation requirements, prototype quantity, annual volume, and schedule. Include the curve table, active travel, wiper design, contact force, movement duty, support, connector, and calibration method.

Request a PI Flexible Position Sensor Quote

Send the sensing artwork, response curve, travel and wiper mechanics, PI support and bend condition, connector, electronics, environment, and validation requirements. Quotation is more reliable when the measurement method and acceptance limits describe the complete sensor rather than the printed element alone.

  • Drawing-led DFM and material-route feedback
  • Prototype and repeat-production route review
  • Confidential handling of customer files
  • Project-specific inspection and validation planning
  • Controlled sensor artwork and dimensioned outline
  • PI grade, thickness, support, and bend condition
  • Resistance or voltage curve with tolerance and direction
  • Active travel, measurement points, loading, and calibration
  • Wiper material, geometry, force, speed, and duty
  • Terminal, connector, housing, and assembly interface
  • Environment, validation, quantity, schedule, and traceability
  1. 1We review the drawing, application, material route, and missing acceptance inputs.
  2. 2You receive DFM questions and a prototype route for approval.
  3. 3Repeat production follows the released revision, inspection plan, and packing requirement.

Submit RFQ and upload files

PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.

Customer drawings are handled as confidential quotation inputs and used only for engineering review, communication, and project follow-up.