Printed circuit and substrate definition
Review ceramic material, outline, datums, printed conductors, resistors, dielectric or protection, openings, tolerances, print sequence, firing compatibility, and inspection access.
Hybrid Circuit Engineering
Custom Thick Film Hybrid Circuit
Custom thick film hybrid circuits can integrate printed conductors, resistors, dielectric or protective layers, mounted components, die interfaces, wire bonds, and external terminals on a compact ceramic platform. Send the drawing, artwork, BOM or die map, electrical and thermal conditions, assembly notes, quantity, and validation plan so engineering can review the complete build.
- Printed ceramic circuit and assembly review
- Component, die, wire-bond, and terminal interfaces
- Prototype-to-production route evaluation
- Project-defined inspection and traceability
- 5 views
- Supplied photo set
- Die attach
- Project-defined
- Wire bonds
- Interface review
- Up to 850°C
- Firing temperature
Product Categories
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Verified capability review
Quick Specifications
Thick Film Hybrid Circuit is shown against approved company capability control sheets.
Capability source: approved company category control sheets. Final values remain drawing- and sample-controlled.
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Substrate Material | 96% Alumina (Al₂O₃) standard route | 99% / 99.6% alumina or AlN through material and process review | Approved material specification, drawing, and incoming criteria |
| Board Thickness | 0.25–3.0 mm | Thickness inside 0.25–3.0 mm is checked against outline, flatness, holes, handling, and firing | Approved material specification, drawing, and incoming criteria |
| Conductor System | Silver (Ag) / Silver-Palladium (Ag-Pd) | Pt-Ag, Au, bonding, soldering, contact, and high-temperature routes by compatible stack review | Approved material stack, assembly interface, and sample |
| Resistor System | RuO₂ thick film | Paste family, sheet resistance, geometry, refire sequence, and trim allowance by circuit target | Released drawing and approved sample |
| Conductor Thickness | 10–25 µm | Value inside 10–25 µm is selected for print build, firing, current path, and assembly | Released drawing, DFM approval, and first-article inspection |
| Resistor Tolerance | ±1% standard | ±0.5% available after geometry, material, trimming, and measurement review | Released drawing and approved sample |
View 6 additional engineering review checks
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Firing Temperature | Up to 850°C | The peak profile is paste- and stack-specific within the approved route; later refires are reviewed together | Approved material-process route and production traveler |
| Thermal Conductivity | ≥24 W/m·K, 96% alumina reference | Alternative alumina grade or AlN route by approved material certificate and system thermal review | Released drawing and approved sample |
| Minimum Line/Space | ≥100 µm | Geometry at the ≥100 µm controlled capability is checked for paste, screen, registration, overlap, edge clearance, and yield | Released drawing, DFM approval, and first-article inspection |
| Board Size | Up to 120 × 120 mm | Larger than 120 × 120 mm by panel, flatness, handling, firing, and inspection review | Released drawing, DFM approval, and first-article inspection |
| Surface Finish | HASL / ENIG / ENEPIG | Finish selected for soldering, bonding, contact, storage, and downstream thermal exposure | Approved material stack, assembly interface, and sample |
| Dielectric Strength | ≥15 kV/mm | Product withstand voltage is derived from dielectric material, fired thickness, clearances, interfaces, and test method | Released insulation stack and agreed IR/withstand test plan |
Engineering Capabilities
Four review controls connect the printed ceramic circuit, component or die assembly, terminals, electrical duty, and validation plan. Supplied photographs support visible-feature review; final materials, dimensions, performance, process limits, and records remain project-controlled.
Artwork and process registration
Control artwork revision, layer-to-layer alignment, paste and screen selection, drying, firing, pad openings, component keep-outs, fiducials, and measurable release limits.
Component, die, and terminal interfaces
Connect the BOM, packages, die map, attach system, wire bonds, pad finish, terminal form, housing, cleaning, protection, and rework rules to one assembly route.
Inspection and validation planning
Select visual, dimensional, electrical, functional, bond, cleanliness, thermal, environmental, traceability, and packing checks with agreed limits, sampling, and records.
Typical Applications
These application illustrations show conditional engineering directions. Suitability depends on the released circuit, assembly, electrical, thermal, mechanical, environmental, and validation requirements.
Application images are engineering illustrations, not customer projects, production records, or evidence of a released design. Suitability is confirmed only after the drawing, interfaces, operating conditions, risks, and validation plan are reviewed.
Application illustrationSensor signal-conditioning modules
Hybrid circuits can be reviewed for compact sensor interfaces after signal levels, resistor functions, input protection, calibration, connector geometry, environment, and functional-test limits are released.
Review sensor inputs
Application illustrationIndustrial control electronics
A ceramic hybrid assembly may support compact control electronics when the schematic, I/O, isolation, terminals, component loading, thermal boundary, enclosure, and validation route are defined.
Review control inputs
Application illustrationCompact hybrid electronics carriers
Printed routing, mounted components, die attach, wire bonds, and terminal interfaces can be reviewed for compact carriers after the complete stack, assembly process, heat path, cleanliness, and reliability plan are released.
Review hybrid inputsVerified Product Views
The supplied photographs visibly confirm multiple hybrid-circuit formats, printed routing and pads, mounted components, a long row of metal leads, and a macro view with a die area and fine wire bonds. They do not establish substrate grade, paste chemistry, dimensions, BOM identity, bond material or strength, electrical function, operating conditions, lot history, inspection results, or shipment status.
- Visible assembly features
- Printed routing, pads, packaged devices, discrete components, soldered joints, external leads, and a die-and-wire-bond area are visible across the supplied photographs.
- Evidence boundary
- Appearance does not identify materials, values, dimensions, component functions, bond specification, electrical performance, operating temperature, reliability, inspection status, or lot traceability.
View 1 additional evidence boundaries
- Required project proof
- Controlled drawings, artwork, BOM and die data, process records, inspection and test results, traceability, and packing evidence must belong to the authorized order before project-specific claims are made.
Manufacturing & Quality
Company resources support thick film screen printing, controlled firing, laboratory inspection, and managed production in Dongguan.
Read the shared manufacturing-control scope
The applicable ceramic, printed system, assembly route, tests, sampling, traceability, and acceptance records are confirmed for each released project.
Technical FAQ
Short answers for quotation planning; released drawings and validation requirements remain controlling.
What is included in a custom thick film hybrid circuit review?
Engineering reviews the ceramic substrate, printed conductor, resistor and dielectric requirements, component and die interfaces, attachment and wire-bond process, terminals, electrical and thermal duty, enclosure, environment, inspection, traceability, quantity, and validation plan as one released assembly. The exact route follows the customer drawing, BOM, artwork, and acceptance criteria.
Can you assemble components or bare die on the thick film circuit?
The available product views show examples with mounted components and a visible die-and-wire-bond area, so those interfaces can be reviewed. Feasibility still depends on the BOM, package data, pad finish, die map, attach system, bond-wire and pad compatibility, thermal profile, cleaning, protection, workmanship standard, inspection, and qualification requirements.
What information is needed to quote a thick film hybrid circuit?
Send the dimensioned drawing, layer artwork, ceramic requirement, net or schematic information, BOM and package data, die map when applicable, conductor and resistor targets, component attachment and wire-bond notes, terminal definition, electrical and thermal conditions, enclosure and environment, prototype and production quantities, inspection plan, and required records.
Do the supplied photographs prove electrical performance or reliability?
No. They confirm visible product form, printed routing, mounted parts, a lead row, and a die-and-wire-bond area. They do not prove material identity, dimensions, values, bond strength, electrical function, operating temperature, cycling life, lot traceability, or shipment status. Those claims require authorized drawings, records, and project-specific results.
Request a Thick Film Hybrid Circuit Quote
Send enough information to connect the ceramic circuit, printed layers, BOM or die map, assembly interfaces, terminals, electrical and thermal duty, environment, validation plan, and order scope. Sample photographs can begin a review, but the production build must be drawing-controlled.
RFQ inputs and review sequence
- Drawing-led DFM feedback and optimization support
- Prototype and production-route evaluation
- Confidential handling of customer drawings
- Project-specific assembly and validation review
- Dimensioned ceramic drawing, layer artwork, net information, viewing direction, datums, tolerances, revision, and substrate requirement
- BOM and package data plus die map, attach, wire-bond, pad finish, terminal, coating, cleaning, and assembly notes where applicable
- Conductor, resistor, dielectric and protection requirements, target values, current, voltage, power, test nodes, and acceptance limits
- Operating and storage environment, heat sources, cooling boundary, enclosure, vibration, humidity, media exposure, and reliability plan
- Prototype quantity, expected lot volume, schedule, sampling, records, traceability, ESD or packing controls, and shipment requirements
- 1Upload drawings, artwork, BOM, and assembly notes
- 2Engineering identifies missing release inputs
- 3Confirm the prototype and validation route
Submit RFQ and upload files
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.
The drawing-upload form loads as you reach this section.