Face orientation and shared datums
Review Face A and Face B naming, viewing direction, mirror rules, common origins, outline references, aperture datums, and inspection access before release.
Double-Sided Ceramic Circuit Engineering
Custom Double-Sided Thick Film Ceramic Circuit
Custom double-sided thick film ceramic circuits place drawing-controlled printed features on both faces of one ceramic substrate. Send Face A and Face B artwork, common datums, aperture definitions, material requirements, electrical targets, assembly details, quantity, and test plan so engineering can review registration, processing, and inspection.
- Face A and Face B artwork review
- Common datum and orientation control
- Aperture, ring, and interface assessment
- Project-defined inspection and records
- Both faces
- Distinct printed geometry
- Shared datums
- Alignment by drawing
- Apertures
- Function by drawing
- Release basis
- Engineering review
Product Categories
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Verified capability review
Quick Specifications
Double-Sided Thick Film Ceramic Circuit is shown against approved company capability control sheets.
Capability source: approved company category control sheets. Final values remain drawing- and sample-controlled.
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Substrate Material | 96% Alumina (Al₂O₃) standard route | 99% / 99.6% alumina or AlN through material and process review | Approved material specification, drawing, and incoming criteria |
| Board Thickness | 0.25–3.0 mm | Thickness inside 0.25–3.0 mm is checked against outline, flatness, holes, handling, and firing | Approved material specification, drawing, and incoming criteria |
| Conductor System | Silver (Ag) / Silver-Palladium (Ag-Pd) | Pt-Ag, Au, bonding, soldering, contact, and high-temperature routes by compatible stack review | Approved material stack, assembly interface, and sample |
| Resistor System | RuO₂ thick film | Paste family, sheet resistance, geometry, refire sequence, and trim allowance by circuit target | Released drawing and approved sample |
| Conductor Thickness | 10–25 µm | Value inside 10–25 µm is selected for print build, firing, current path, and assembly | Released drawing, DFM approval, and first-article inspection |
| Resistor Tolerance | ±1% standard | ±0.5% available after geometry, material, trimming, and measurement review | Released drawing and approved sample |
View 7 additional engineering review checks
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Firing Temperature | Up to 850°C | The peak profile is paste- and stack-specific within the approved route; later refires are reviewed together | Approved material-process route and production traveler |
| Thermal Conductivity | ≥24 W/m·K, 96% alumina reference | Alternative alumina grade or AlN route by approved material certificate and system thermal review | Released drawing and approved sample |
| Minimum Line/Space | ≥100 µm | Geometry at the ≥100 µm controlled capability is checked for paste, screen, registration, overlap, edge clearance, and yield | Released drawing, DFM approval, and first-article inspection |
| Board Size | Up to 120 × 120 mm | Larger than 120 × 120 mm by panel, flatness, handling, firing, and inspection review | Released drawing, DFM approval, and first-article inspection |
| Surface Finish | HASL / ENIG / ENEPIG | Finish selected for soldering, bonding, contact, storage, and downstream thermal exposure | Approved material stack, assembly interface, and sample |
| Dielectric Strength | ≥15 kV/mm | Product withstand voltage is derived from dielectric material, fired thickness, clearances, interfaces, and test method | Released insulation stack and agreed IR/withstand test plan |
| Face A / Face B control | Both printed faces controlled on one released drawing | Side-to-side registration, interconnect, datums, keep-outs, and inspection by DFM | Approved Face A/B artwork and first-article verification |
Engineering Capabilities
Four controls connect the two artwork faces to one manufacturable ceramic circuit. Visible product geometry supports an initial review; final materials, construction, numerical limits, electrical performance, and records remain project-controlled.
Face-specific printing and registration
Plan artwork compensation, fixtures, print order, layer openings, drying, firing interactions, and the front-to-back measurement method against one revision.
Aperture and ring review
Define each opening as mechanical, metallized, filled, isolated, or interconnected. Visible rings alone do not prove hole-wall construction or electrical continuity.
Inspection matched to release
Select visual, dimensional, registration, continuity, isolation, electrical, adhesion, traceability, and packing checks from drawing requirements and project risk.
Typical Applications
These application directions show where a drawing-controlled double-sided ceramic route may fit after the interfaces, aperture functions, electrical loading, environment, and validation plan are defined.
Application images are engineering illustrations, not customer projects, production records, or evidence of a released design. Suitability is confirmed only after the drawing, interfaces, operating conditions, risks, and validation plan are reviewed.
Application illustrationDual-face ceramic interfaces
Printed functions on two faces can share one ceramic outline, aperture pattern, connector layout, and controlled orientation when the complete interface is drawing-defined.
Review interface inputs
Application illustrationMulti-channel sensor routing
A paired-face layout may support multi-channel sensor connections after the net definition, media exposure, connector duty, isolation, and measurement plan are released.
Review sensor inputs
Application illustrationPrecision test and calibration fixtures
Dense apertures and repeated geometry can be evaluated around fixture datums, probe access, electrical targets, calibration conditions, and agreed acceptance limits.
Review test inputsVerified Product Views
Four supplied photographs confirm different printed geometry on opposite faces of the same long ceramic form, repeated aperture rows, metal-colored rings, green surface coverage, and end mounting holes. They do not establish ceramic grade, aperture construction, between-face continuity, electrical performance, dimensions, tolerances, inspection results, lot history, or shipment traceability.
- Available product views
- Five gallery views present the four supplied real photographs as paired, single-face, stacked, and close product views.
- Visible construction
- Opposite-side printed patterns, repeated aperture rows, metal-colored rings, green coverage, white end areas, end mounting holes, and smaller end-hole arrays are visible.
View 1 additional evidence boundaries
- Required project proof
- Ceramic material, dimensions, aperture construction, between-face connections, electrical results, inspection records, lot history, and packing evidence require the corresponding authorized project files.
Manufacturing & Quality
Company-level resources support screen printing, controlled firing, route-dependent laser trimming, and final inspection for ceramic thick film projects.
Read the shared manufacturing-control scope
The applicable material system, print sequence, alignment method, firing profile, electrical checks, records, and acceptance limits are confirmed against each released drawing and validation plan.
Technical FAQ
Short answers for quotation planning; released drawings and validation requirements remain controlling.
What makes a thick film ceramic circuit double-sided?
A double-sided product has drawing-controlled printed features on both faces of the same ceramic substrate. The released package must identify Face A and Face B, their orientation and mirror rules, common datums, layer sequence, aperture duty, electrical function, assembly interface, and inspection method.
Do the visible metal-colored rings prove electrical vias?
No. The photographs confirm metal-colored rings around many apertures, but surface appearance does not establish hole-wall metallization, paste filling, front-to-back continuity, current capacity, insulation, or reliability. These requirements need controlled drawings, construction records, and an agreed electrical test.
What files are needed to quote a double-sided ceramic circuit?
Send the dimensioned outline, separate Face A and Face B artwork, orientation and mirror rules, shared datums, aperture table, substrate requirement, printed layer notes, electrical targets, assembly details, tests, quantity, and required records. PDF, Gerber, DXF, DWG, STEP, Excel, and clear sample photographs can support the review.
How is front-to-back registration controlled?
Engineering reviews common datums, face orientation, mirror rules, aperture references, fixture strategy, print sequence, artwork compensation, and measurement access. A numerical registration tolerance and inspection method are confirmed only from the controlled drawing, material system, geometry, and process review.
Request a Double-Sided Thick Film Ceramic Circuit Quote
Send enough information to connect both printed faces, shared datums, apertures, ceramic material, electrical function, assembly interface, operating conditions, and acceptance method. Clear sample photographs can start an engineering review when final drawings are not ready.
RFQ inputs and review sequence
- Drawing-led DFM feedback and optimization support
- Prototype and production-route evaluation
- Confidential handling of customer drawings
- Project-specific material, alignment, and test review
- Dimensioned outline plus Gerber, DXF, DWG, PDF, STEP, or clear measured sample photographs with revision
- Separate Face A and Face B artwork, viewing direction, mirror rules, common datums, registration tolerance, and aperture table
- Ceramic material, thickness, surface condition, printed materials, layer sequence, openings, joining duty, and assembly method
- Electrical targets, test nodes, loading, insulation, operating environment, validation method, and acceptance limits
- Prototype quantity, expected lot volume, schedule, records, traceability, and protected packing requirements
- 1Upload both face drawings or measured sample photos
- 2Engineering identifies missing release inputs
- 3Confirm the prototype and validation route
Submit RFQ and upload files
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.
The drawing-upload form loads as you reach this section.