01
Engineering review
Drawing, sample, substrate, resistance, tolerance, and application requirement review.
Chipsimple
About Us
Chipsimple Electronic Tech integrates R&D, manufacturing, screen printing, sintering, laser trimming, and reliability testing for custom thick film ceramic PCB and heating element solutions.
About Chipsimple
Thick film ceramic circuit manufacturing built around controlled process flow
Chipsimple Electronic Tech supports custom ceramic thick film PCB, resistor cards, sensor circuits, heating elements, and hybrid circuit substrates from engineering review through repeat production.
Our production route covers substrate inspection, cleaning, screen preparation, thick film printing, drying, tunnel firing, laser trimming, scribing, electrical inspection, and reliability validation. Each step is organized for stable resistance values, clean conductor geometry, consistent thermal behavior, and traceable batch quality.
2M+Annual thick film product capacity
100KClean workshop process control
4,800+m2 production and inspection space
Manufacturing Flow
Process photos from engineering review to shipment
Use this process overview to understand how custom thick film ceramic circuits move through controlled workshop operations before final release.
02
Substrate inspection
Incoming ceramic substrates are checked before production routing and fixture setup.
03
Cleaning
Substrates are cleaned and prepared to support paste adhesion and stable printing.
04
Screen preparation
Screen layout and stencil condition are controlled before paste deposition.
05
Screen printing
Conductive, resistive, dielectric, or heater patterns are printed by fixture and process route.
06
Drying
Printed layers are dried before firing to control film quality and registration.
07
Tunnel firing
Furnace processing converts printed films into stable conductor and resistor structures.
08
Scribing and cutting
Laser scribing and profiling support ceramic outline, panel separation, and precision features.
09
Visual inspection
Microscope inspection checks line quality, conductor pads, resistor geometry, and surface defects.
10
Electrical testing
Resistance, continuity, insulation, and functional output are checked to project requirements.
11
Reliability validation
Thermal, humidity, and application-related stress checks can be planned for critical projects.
12
Packing and shipment
Finished parts are packed in protective trays or customer-specified packaging for delivery.
Quality System
Inspection and validation aligned with real application risk
Different thick film products require different checks. Fuel level sensor cards, throttle position resistors, heater plates, hybrid substrates, and metallized ceramic circuits are reviewed against their electrical function and operating environment.
- Resistance value, tolerance, curve, continuity, insulation, and functional output checks.
- Microscope inspection for printing quality, overlap, pad condition, ceramic edge quality, and contamination.
- Environmental or aging validation for high temperature, humidity, power loading, fuel/oil exposure, and lifecycle risk where required.
Factory Tour
Clean workshop, laboratory, product, and logistics areas
A practical view of the spaces that support custom thick film ceramic PCB development and repeat production.
Send drawings or samples for technical review
Share substrate, dimensions, resistance value, voltage, power, operating temperature, annual volume, and testing requirements. Chipsimple will review the project and respond with a practical production suggestion.