
Sensing-function definition
Define the measured quantity, motion transfer, active range, output curve, resolution needs, inactive zones, channel count, and electrical interface before choosing the pattern.

Drawing-defined resistive sensing element
A custom resistive sensor element can be shaped around a project-specific motion, level, or interface requirement when the mechanical transfer, printed geometry, resistance behavior, contact system, electronics, and environment are defined together. Chipsimple supports the drawing, material-route, prototype, and validation review.
Category-level selection values cover substrate, sensor geometry, printed systems, track count, resistance behavior, contact route, and operating environment. Final values are confirmed against the customer drawing, mating contact, electronics, and validation method.
Final values confirmed against customer drawing.
| Substrate Material | Alumina / FR-4 / PI |
|---|---|
| Sensor Geometry | Rotary / Linear / Arc |
| Resistor System | RuO₂ / Carbon |
| Conductor System | Ag / Ag-Pd / Au / Ag-C |
| Track Count | 1–4 tracks typical |
| Nominal Resistance | 100 Ω–1 MΩ typical |
| Resistance Curve | Linear / Nonlinear / Segmented |
|---|---|
| Resistance Tolerance | ±1–10% by material system |
| Linearity | ±0.5–2% FS typical |
| TCR | ±100–200 ppm/°C ceramic reference |
| Contact System | Precious metal / Carbon |
| Operating Temperature | -40 to +125°C, system-dependent |
A useful custom review converts the sensing problem into controlled geometry, materials, interfaces, and test criteria. The element is not released from a product name alone; it is released from the complete measurement chain.

Define the measured quantity, motion transfer, active range, output curve, resolution needs, inactive zones, channel count, and electrical interface before choosing the pattern.

Select alumina, FR-4, or PI and a compatible resistor, conductor, pad, and overlap system against geometry, assembly, environment, and validation needs.

Review support, mounting, datum scheme, wiper or contact material, force, speed, path, terminals, connector, enclosure, and tolerance stack as one interface.

Release drawing-defined dimensional, resistance, curve, linearity, contact, environmental, lifecycle, and calibration checks with the prototype and production plan.
Custom elements may support several sensing directions, but each requires its own mechanics, electronics, contact system, environment, and validation program.
Application illustrationCustom elements may fit joints, actuators, or slides after travel, speed, support, contact force, output curve, controller loading, duty, and calibration are defined.
Review application inputs
Application illustrationIndustrial modules require controlled mounting, enclosure, terminals, loading, temperature, contamination, signal conditioning, inspection, and field-duty validation.
Review application inputs
Application illustrationProcess instruments can be evaluated only after the measured variable, mechanical transfer, media isolation, electrical response, calibration, and environmental limits are released.
Review application inputsVerified photographs show complete white rectangular elements with visible arc-shaped printed regions, conductor routing, terminals, and sample markings. Surface appearance alone does not identify the material system or establish electrical and reliability performance.

Chipsimple supports drawing-led printed sensor elements with controlled printing, resistance adjustment where applicable, dimensional and electrical inspection, and protected handling. The exact route depends on substrate, resistor system, contact design, and validation plan; these photographs show general company capability, not evidence of the displayed product batch.
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Short answers for quotation planning; released drawings and validation requirements remain controlling.
Begin with the measured variable, motion or interface, active range, available envelope, output curve, channel count, electrical loading, contact mechanics, mounting, terminals, environment, lifecycle target, calibration, and acceptance method. These inputs determine the appropriate substrate and printed-system route.
No. These are category-level selection values, not a released part specification. Substrate, resistor and conductor systems, geometry, resistance, tolerance, linearity, TCR, contact route, and operating temperature are narrowed against the drawing, mating mechanics, electronics, and validation plan.
Validate the element with production-intent mechanics, contacts, electronics, support, and enclosure. Check the complete output across travel, repeatability, hysteresis, contact stability, loading, environment, cycling, calibration, and inspection correlation against released limits.
Send the controlled drawing or artwork, dimensions and tolerances, active travel or angle, resistance and output-curve data, track count, mating contact, electrical loading, environment, validation method, quantity, and schedule. If the concept is new, include a system sketch and measurement chain showing how the input variable reaches the sensing surface and how the signal is conditioned.
Share the sensing objective, mechanism, envelope, output curve, contact concept, electronics, environment, and acceptance targets. We will convert the brief into DFM questions and a controlled prototype route.
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.
