Ceramic and metallization route
Confirm alumina or AlN grade, thickness, surface condition, conductor system, gold route and thickness, adhesion, firing or finishing compatibility, and assembly use.
Two-sided ceramic metallization
Double-Sided Gold-Plated Ceramic PCB
Double-sided gold-plated ceramic PCBs place drawing-defined metallization and assembly features on both faces of a ceramic substrate. Chipsimple reviews ceramic grade, thickness, front-to-back artwork, hole and edge features, conductor or finish route, registration, bonding or soldering interface, continuity, isolation, and inspection before release.
- Front and back artwork coordinated
- Hole and edge features reviewed by drawing
- Gold interface matched to assembly
- Continuity and isolation test plan released
2 sidesVisible metallized faces
Ag / Ag-Pd / Pt-Ag / AuCategory conductor routes
5Verified product views
By drawingInterconnect release
On this pageOverview
Quick Specifications
These ceramic thick film values support early material and geometry selection. Ceramic grade, two-sided artwork, conductor system, finish thickness, holes, edge features, registration, any through-connection route, assembly interface, continuity, isolation, and inspection are released from the controlled drawing.
Final values confirmed against customer drawing.
| Substrate Material | 96% / 99% / 99.6% Alumina / AlN |
|---|---|
| Board Thickness | 0.25–3.0 mm |
| Conductor System | Ag / Ag-Pd / Pt-Ag / Au |
| Resistor System | RuO₂ thick film |
| Conductor Thickness | 10–25 µm typical |
| Resistance Tolerance | ±1% standard (±0.5% available) |
| Firing Temperature | Up to 850°C |
|---|---|
| Thermal Conductivity | ≥24 W/m·K, 96% alumina reference |
| Minimum Line/Space | ≥100 µm |
| Board Size | Max. 120 × 120 mm; larger on request |
| Surface Finish | Bare Ag / ENIG / ENEPIG |
| Dielectric Strength | ≥15 kV/mm |
Engineering Capabilities
A two-sided ceramic PCB is reviewed face by face and interface by interface. Engineering connects substrate properties, front and back artwork, fiducials, hole preparation, edge geometry, compatible conductor and finish, refire sequence, masking, bonding or soldering surfaces, interconnect definition, dimensional tolerance, continuity, isolation, and handling risk.
Front-to-back registration
Release both face artworks with fiducials, datums, holes, edge contacts, scallops, mask areas, alignment tolerances, and a clear layer sequence.
Holes and assembly interfaces
Define whether holes are mechanical, metallized, filled, or electrically connected, plus bonding, soldering, contact, mounting, cleaning, and downstream thermal conditions.
Continuity, isolation, and finish
Specify dimensions, appearance, finish thickness if required, adhesion, front-to-back continuity, isolation, contact or bondability, sampling, and acceptance limits.
Typical Applications
Two-sided gold-interface ceramic boards can support compact modules when the interconnect, assembly process, thermal path, and electrical inspection are explicitly released.
Application illustrationPower control modules
Compact power-control assemblies require reviewed thermal path, isolation, conductor current, die or component attach, wire bonding or soldering, and inspection conditions.
Review application inputs
Application illustrationRF and microwave modules
Gold-interface ceramics can be considered only after line geometry, finish, grounding, loss, attachment, cleanliness, frequency, and RF validation requirements are defined.
Review application inputs
Application illustrationHigh-reliability hybrid electronics
Avionics and industrial hybrids require program-specific material declarations, traceability, bonding, thermal cycling, vibration, electrical tests, and qualification evidence.
Review application inputsVerified Product Views
The verified photographs show white ceramic parts with gold-colored surface metallization, holes, scalloped edges, repeated pad and rail patterns, and at least two visible face designs. Surface views cannot prove substrate grade, gold thickness, hidden layers, plated-through holes, front-to-back electrical continuity, adhesion, or bondability.
- Visible surfaces
- Gold-colored pads and rails, white ceramic, holes, scallops, and alternate face patterns are visible.
- Finish boundary
- Color does not establish gold chemistry, thickness, porosity, adhesion, solderability, or wire-bond performance.
- Via boundary
- A visible hole does not prove metallization, plating, filling, or electrical continuity through the ceramic.
- Material boundary
- Ceramic composition, thickness, flatness, thermal properties, and dielectric performance require controlled documentation.
Manufacturing & Quality
Chipsimple supports controlled printing, thermal processing, laboratory inspection, and managed production in Dongguan. Two-sided ceramic projects release the substrate, both artworks, conductor and finish route, interconnect definition, assembly surfaces, electrical tests, sampling, traceability, and acceptance records together; special bonding claims require project validation.
View Full Capabilities
Technical FAQ
Short answers for quotation planning; released drawings and validation requirements remain controlling.
What should be defined first for a custom Double-Sided Gold-Plated Ceramic PCB?
Define ceramic grade and thickness, both face artworks, datums, holes and edge features, conductor and gold route, required finish thickness, front-to-back interconnect, bonding or soldering method, current, voltage, isolation, thermal conditions, dimensions, cleanliness, inspection, and downstream assembly profile.
Are the quick specification values guaranteed for every design?
No. They are practical category-level selection values, not a released product specification. Material compatibility, geometry, print build, electrical loading, assembly, environment, inspection method, and expected volume can narrow the usable window. Final values are confirmed against the controlled drawing and approved project conditions.
How should Double-Sided Gold-Plated Ceramic PCB performance be validated?
Verify dimensions, flatness and visual criteria, front-to-back registration, conductor and finish condition, adhesion, required thickness, continuity and isolation, plus solderability, contact, or wire-bond tests that match the intended assembly. Hole metallization and electrical continuity must be tested, not inferred from appearance.
What should be included with an RFQ?
Send the controlled drawing or artwork, dimensions and tolerances, material preference, electrical targets, assembly interface, operating environment, validation requirements, prototype quantity, annual volume, and schedule. Include separate front and back data, the hole/interconnect definition, gold process and thickness, assembly method, and continuity or isolation limits.
Request a Double-Sided Gold-Plated Ceramic PCB Quote
Send separate front and back artwork with the ceramic, hole, interconnect, finish, assembly, and electrical requirements. Clear definitions for metallized holes, gold thickness, bonding or soldering, continuity, isolation, and datums prevent surface appearance from being mistaken for a released two-sided connection.
- Drawing-led DFM and material-route feedback
- Prototype and repeat-production route review
- Confidential handling of customer files
- Project-specific inspection and validation planning
- Front and back Gerber, drawing, datums, and revision
- Ceramic material, thickness, flatness, outline, holes, and edges
- Conductor system, gold route, thickness, and masked areas
- Mechanical, metallized, filled, or connected hole definition
- Bonding, soldering, contact, cleaning, and assembly profile
- Continuity, isolation, adhesion, finish, and dimensional tests
- Quantity, schedule, sampling, traceability, and packing
- 1We review the drawing, application, material route, and missing acceptance inputs.
- 2You receive DFM questions and a prototype route for approval.
- 3Repeat production follows the released revision, inspection plan, and packing requirement.
Submit RFQ and upload files
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.