Ceramic and metallization route
Confirm alumina or AlN grade, thickness, surface condition, conductor system, gold route and thickness, adhesion, firing or finishing compatibility, and assembly use.
Two-sided ceramic metallization
Double-Sided Gold-Plated Ceramic PCB
Double-sided gold-plated ceramic PCBs place drawing-defined metallization and assembly features on both faces of a ceramic substrate. Chipsimple reviews ceramic grade, thickness, front-to-back artwork, hole and edge features, conductor or finish route, registration, bonding or soldering interface, continuity, isolation, and inspection before release.
- Front and back artwork coordinated
- Hole and edge features reviewed by drawing
- Gold interface matched to assembly
- Continuity and isolation test plan released
- 2 sides
- Visible metallized faces
- Ag / Ag-Pd / Pt-Ag / Au
- Category conductor routes
- 5
- Verified product views
- By drawing
- Interconnect release
Product Categories
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Verified capability review
Quick Specifications
Double-Sided Gold-Plated Ceramic PCB is shown against approved company capability control sheets.
Capability source: approved company category control sheets. Final values remain drawing- and sample-controlled.
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Substrate Material | 96% Alumina (Al₂O₃) standard route | 99% / 99.6% alumina or AlN through material and process review | Approved material specification, drawing, and incoming criteria |
| Board Thickness | 0.25–3.0 mm | Thickness inside 0.25–3.0 mm is checked against outline, flatness, holes, handling, and firing | Approved material specification, drawing, and incoming criteria |
| Conductor System | Silver (Ag) / Silver-Palladium (Ag-Pd) | Pt-Ag, Au, bonding, soldering, contact, and high-temperature routes by compatible stack review | Approved material stack, assembly interface, and sample |
| Resistor System | RuO₂ thick film | Paste family, sheet resistance, geometry, refire sequence, and trim allowance by circuit target | Released drawing and approved sample |
| Conductor Thickness | 10–25 µm | Value inside 10–25 µm is selected for print build, firing, current path, and assembly | Released drawing, DFM approval, and first-article inspection |
| Resistor Tolerance | ±1% standard | ±0.5% available after geometry, material, trimming, and measurement review | Released drawing and approved sample |
View 7 additional engineering review checks
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Firing Temperature | Up to 850°C | The peak profile is paste- and stack-specific within the approved route; later refires are reviewed together | Approved material-process route and production traveler |
| Thermal Conductivity | ≥24 W/m·K, 96% alumina reference | Alternative alumina grade or AlN route by approved material certificate and system thermal review | Released drawing and approved sample |
| Minimum Line/Space | ≥100 µm | Geometry at the ≥100 µm controlled capability is checked for paste, screen, registration, overlap, edge clearance, and yield | Released drawing, DFM approval, and first-article inspection |
| Board Size | Up to 120 × 120 mm | Larger than 120 × 120 mm by panel, flatness, handling, firing, and inspection review | Released drawing, DFM approval, and first-article inspection |
| Surface Finish | HASL / ENIG / ENEPIG | Finish selected for soldering, bonding, contact, storage, and downstream thermal exposure | Approved material stack, assembly interface, and sample |
| Dielectric Strength | ≥15 kV/mm | Product withstand voltage is derived from dielectric material, fired thickness, clearances, interfaces, and test method | Released insulation stack and agreed IR/withstand test plan |
| Face A / Face B control | Both printed faces controlled on one released drawing | Side-to-side registration, interconnect, datums, keep-outs, and inspection by DFM | Approved Face A/B artwork and first-article verification |
Engineering Capabilities
A two-sided ceramic PCB is reviewed face by face and interface by interface. Engineering connects substrate properties, front and back artwork, fiducials, hole preparation, edge geometry, compatible conductor and finish, refire sequence, masking, bonding or soldering surfaces, interconnect definition, dimensional tolerance, continuity, isolation, and handling risk.
Front-to-back registration
Release both face artworks with fiducials, datums, holes, edge contacts, scallops, mask areas, alignment tolerances, and a clear layer sequence.
Holes and assembly interfaces
Define whether holes are mechanical, metallized, filled, or electrically connected, plus bonding, soldering, contact, mounting, cleaning, and downstream thermal conditions.
Continuity, isolation, and finish
Specify dimensions, appearance, finish thickness if required, adhesion, front-to-back continuity, isolation, contact or bondability, sampling, and acceptance limits.
Typical Applications
Two-sided gold-interface ceramic boards can support compact modules when the interconnect, assembly process, thermal path, and electrical inspection are explicitly released.
Application images are engineering illustrations, not customer projects, production records, or evidence of a released design. Suitability is confirmed only after the drawing, interfaces, operating conditions, risks, and validation plan are reviewed.
Application illustrationPower control modules
Compact power-control assemblies require reviewed thermal path, isolation, conductor current, die or component attach, wire bonding or soldering, and inspection conditions.
Review application inputs
Application illustrationRF and microwave modules
Gold-interface ceramics can be considered only after line geometry, finish, grounding, loss, attachment, cleanliness, frequency, and RF validation requirements are defined.
Review application inputs
Application illustrationHigh-reliability hybrid electronics
Avionics and industrial hybrids require program-specific material declarations, traceability, bonding, thermal cycling, vibration, electrical tests, and qualification evidence.
Review application inputsVerified Product Views
The verified photographs show white ceramic parts with gold-colored surface metallization, holes, scalloped edges, repeated pad and rail patterns, and at least two visible face designs. Surface views cannot prove substrate grade, gold thickness, hidden layers, plated-through holes, front-to-back electrical continuity, adhesion, or bondability.
- Visible surfaces
- Gold-colored pads and rails, white ceramic, holes, scallops, and alternate face patterns are visible.
- Finish boundary
- Color does not establish gold chemistry, thickness, porosity, adhesion, solderability, or wire-bond performance.
View 2 additional evidence boundaries
- Via boundary
- A visible hole does not prove metallization, plating, filling, or electrical continuity through the ceramic.
- Material boundary
- Ceramic composition, thickness, flatness, thermal properties, and dielectric performance require controlled documentation.
Manufacturing & Quality
Chipsimple supports controlled printing, thermal processing, laboratory inspection, and managed production in Dongguan.
Read the shared manufacturing-control scope
Two-sided ceramic projects release the substrate, both artworks, conductor and finish route, interconnect definition, assembly surfaces, electrical tests, sampling, traceability, and acceptance records together; special bonding claims require project validation.
Technical FAQ
Short answers for quotation planning; released drawings and validation requirements remain controlling.
What should be defined first for a custom Double-Sided Gold-Plated Ceramic PCB?
Define ceramic grade and thickness, both face artworks, datums, holes and edge features, conductor and gold route, required finish thickness, front-to-back interconnect, bonding or soldering method, current, voltage, isolation, thermal conditions, dimensions, cleanliness, inspection, and downstream assembly profile.
Are the quick specification values guaranteed for every design?
No. They are practical category-level selection values, not a released product specification. Material compatibility, geometry, print build, electrical loading, assembly, environment, inspection method, and expected volume can narrow the usable window. Final values are confirmed against the controlled drawing and approved project conditions.
How should Double-Sided Gold-Plated Ceramic PCB performance be validated?
Verify dimensions, flatness and visual criteria, front-to-back registration, conductor and finish condition, adhesion, required thickness, continuity and isolation, plus solderability, contact, or wire-bond tests that match the intended assembly. Hole metallization and electrical continuity must be tested, not inferred from appearance.
What should be included with an RFQ?
Send the controlled drawing or artwork, dimensions and tolerances, material preference, electrical targets, assembly interface, operating environment, validation requirements, prototype quantity, annual volume, and schedule. Include separate front and back data, the hole/interconnect definition, gold process and thickness, assembly method, and continuity or isolation limits.
Request a Double-Sided Gold-Plated Ceramic PCB Quote
Send separate front and back artwork with the ceramic, hole, interconnect, finish, assembly, and electrical requirements. Clear definitions for metallized holes, gold thickness, bonding or soldering, continuity, isolation, and datums prevent surface appearance from being mistaken for a released two-sided connection.
RFQ inputs and review sequence
- Drawing-led DFM and material-route feedback
- Prototype and repeat-production route review
- Confidential handling of customer files
- Project-specific inspection and validation planning
- Front and back Gerber, drawing, datums, and revision
- Ceramic material, thickness, flatness, outline, holes, and edges
- Conductor system, gold route, thickness, and masked areas
- Mechanical, metallized, filled, or connected hole definition
- Bonding, soldering, contact, cleaning, and assembly profile
- Continuity, isolation, adhesion, finish, and dimensional tests
- Quantity, schedule, sampling, traceability, and packing
- 1We review the drawing, application, material route, and missing acceptance inputs.
- 2You receive DFM questions and a prototype route for approval.
- 3Repeat production follows the released revision, inspection plan, and packing requirement.
Submit RFQ and upload files
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.
The drawing-upload form loads as you reach this section.