AlN material and heat path
Review grade, thickness, surface, heat sources, interface materials, mounting, cooling boundary, insulation, temperature limits, and assembly-level thermal validation together.
Aluminum Nitride Circuit Engineering
Custom AlN Thick Film PCB
Custom AlN thick film PCBs combine a drawing-selected aluminum nitride substrate with printed routing, pads, protection, and assembly interfaces for thermally demanding electronics. Send the material requirement, artwork, heat sources, cooling boundary, joining method, electrical targets, quantity, and inspection plan so engineering can review the complete route.
- AlN grade and thermal-path review
- Conductor and pad interface planning
- Artwork, aperture, and registration control
- Project-defined inspection records
- AlN ceramic
- Grade by drawing
- Thermal path
- Assembly reviewed
- Pad system
- Joining by project
- Release basis
- Engineering review
Product Categories
On this pageJump to section
Verified capability review
Quick Specifications
AlN Thick Film PCB is shown against approved company capability control sheets.
Capability source: approved company category control sheets. Final values remain drawing- and sample-controlled.
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Substrate Material | AlN ceramic; grade controlled by the material specification | AlN grade, thickness, surface condition, flatness, and supplier route by material review | Approved material specification, drawing, and incoming criteria |
| Board Thickness | 0.25–3.0 mm | Thickness inside 0.25–3.0 mm is checked against outline, flatness, holes, handling, and firing | Approved material specification, drawing, and incoming criteria |
| Conductor System | Ag / Ag-Pd / Pt-Ag / Au, selected for the AlN stack | Pt-Ag, Au, bonding, soldering, contact, and high-temperature routes by compatible stack review | Approved material stack, assembly interface, and sample |
| Resistor System | RuO₂ thick film | Paste family, sheet resistance, geometry, refire sequence, and trim allowance by circuit target | Released drawing and approved sample |
| Conductor Thickness | 10–25 µm | Value inside 10–25 µm is selected for print build, firing, current path, and assembly | Released drawing, DFM approval, and first-article inspection |
| Resistor Tolerance | ±1% standard | ±0.5% available after geometry, material, trimming, and measurement review | Released drawing and approved sample |
View 6 additional engineering review checks
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Firing Temperature | Up to 850°C | The peak profile is paste- and stack-specific within the approved route; later refires are reviewed together | Approved material-process route and production traveler |
| Thermal Conductivity | AlN value controlled by the approved grade certificate | Thermal path and conductivity are reviewed from the selected AlN certificate; the alumina value is not reused | Released drawing and approved sample |
| Minimum Line/Space | ≥100 µm | Geometry at the ≥100 µm controlled capability is checked for paste, screen, registration, overlap, edge clearance, and yield | Released drawing, DFM approval, and first-article inspection |
| Board Size | Up to 120 × 120 mm | Larger than 120 × 120 mm by panel, flatness, handling, firing, and inspection review | Released drawing, DFM approval, and first-article inspection |
| Surface Finish | Bare Ag / ENIG / ENEPIG | Finish selected for soldering, bonding, contact, storage, and downstream thermal exposure | Approved material stack, assembly interface, and sample |
| Dielectric Strength | ≥15 kV/mm | Product withstand voltage is derived from dielectric material, fired thickness, clearances, interfaces, and test method | Released insulation stack and agreed IR/withstand test plan |
Engineering Capabilities
Four reviews connect the selected AlN material, printed circuit, heat path, assembly, and acceptance plan. Final material properties, numerical performance, joining compatibility, and records remain controlled by approved project documents.
Artwork and print registration
Check line and spacing rules, large pad coverage, openings, keep-outs, common datums, print direction, artwork compensation, and measurable registration criteria.
Joining and aperture interfaces
Define pad duty, soldering or bonding route, cleaning, rework, hole purpose, ring construction, front-to-back connection needs, housing, and mechanical loads.
Inspection matched to release
Select visual, dimensional, surface, continuity, isolation, bonding, thermal, traceability, and packing checks with agreed conditions, limits, sampling, and records.
Typical Applications
These application directions show where an AlN route may fit after thermal, electrical, mechanical, assembly, environmental, and validation requirements are released.
Application images are engineering illustrations, not customer projects, production records, or evidence of a released design. Suitability is confirmed only after the drawing, interfaces, operating conditions, risks, and validation plan are reviewed.
Application illustrationPower module thermal interfaces
AlN circuits can be evaluated for power assemblies when heat sources, losses, conductor duty, attachment, interface material, cooling boundary, voltage spacing, temperature limits, and validation method are defined.
Review thermal inputs
Application illustrationLED thermal substrates
LED assemblies require a complete review of die or package attachment, circuit geometry, optical layout, heat spreading, interface resistance, operating temperature, cycling, insulation, and inspection criteria.
Review LED interfaces
Application illustrationOptoelectronic and hybrid submounts
Compact submounts may be reviewed around pad finish, die attach, wire bonding, alignment, optical access, signal integrity, heat flow, cleanliness, rework, and project-specific acceptance tests.
Review submount inputsVerified Product Views
The available views show rectangular ceramic parts with gold-colored routing and pads, green coverage, drilled openings, metal-colored rings, and gray rear surfaces in paired and small-group arrangements. They do not establish AlN grade, thermal conductivity, conductor chemistry, hole-wall construction, electrical performance, dimensions, inspection results, lot history, or shipment traceability.
- Visible product form
- Rectangular ceramic pieces, gold-colored routes and pads, green coverage, drilled openings, metal-colored rings, and different front and rear surfaces are visible.
- Quotation boundary
- AlN grade, material data, dimensions, conductor system, aperture construction, thermal boundary, joining compatibility, and acceptance limits remain project-controlled.
View 1 additional evidence boundaries
- Required project proof
- Material certificates, cross-sections, electrical and thermal results, inspection records, traceable lot photographs, and packing evidence require the corresponding authorized order files.
Manufacturing & Quality
Company resources support thick film screen printing, controlled firing, laboratory inspection, and managed production at the Dongguan site.
Read the shared manufacturing-control scope
The applicable AlN material, artwork, thermal route, electrical checks, sampling, traceability, and acceptance records are confirmed for each released project.
Technical FAQ
Short answers for quotation planning; released drawings and validation requirements remain controlling.
What information is needed to quote an AlN thick film PCB?
Send the controlled drawing and artwork, selected AlN grade or required material data, thickness, conductor and pad duty, thermal boundary conditions, joining process, electrical targets, assembly details, inspection criteria, quantity, schedule, and required records. Clear sample photographs can support the first review when CAD data is incomplete.
Do you publish one standard thermal conductivity for AlN circuits?
No single value is presented as a product guarantee. The engineering basis comes from the selected material manufacturer and grade, thickness, surface condition, approved material data, interface layers, mounting, cooling boundary, and the customer's assembly-level model or agreed thermal test.
Are the gold-colored areas suitable for soldering or wire bonding?
Color alone cannot answer that question. State the joining process, alloy or wire system, temperatures, cleaning route, pad geometry, required wetting or pull evaluation, rework conditions, and operating environment. Engineering then reviews the conductor or finish system and its project-specific acceptance method.
Do visible metal rings prove metallized vias?
No. The photographs confirm metal-colored rings around openings, but they do not prove hole-wall metallization, fill, front-to-back continuity, current capacity, isolation, or reliability. Define every aperture function on the drawing and include cross-section, continuity, isolation, or other verification when the design requires it.
Request an AlN Thick Film PCB Quote
Send enough information to connect the selected AlN grade, circuit artwork, thermal path, pad and aperture duties, assembly route, operating conditions, inspection plan, and order scope. Clear sample photographs can begin a review when final CAD data is not ready.
RFQ inputs and review sequence
- Drawing-led DFM feedback and optimization support
- Prototype and production-route evaluation
- Confidential handling of customer drawings
- Project-specific thermal and joining review
- Dimensioned drawing plus Gerber, DXF, DWG, PDF, STEP, or measured sample photographs with revision
- AlN manufacturer and grade, thickness, surface condition, approved material data, certificate needs, outline, holes, and tolerances
- Conductor or finish system, artwork, pad duty, protective layers, hole and ring function, joining method, and assembly details
- Heat sources, losses, interface materials, cooling boundary, electrical targets, environment, validation method, and acceptance limits
- Prototype quantity, expected lot volume, schedule, sampling, records, traceability, and protected packing requirements
- 1Upload drawings or measured sample photographs
- 2Engineering identifies missing release inputs
- 3Confirm the prototype and validation route
Submit RFQ and upload files
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.
The drawing-upload form loads as you reach this section.