Automotive sensing
Position, level, throttle, oil, and related sensor projects connect track geometry, wiper contact, output curve, wear, media exposure, and end-of-line calibration.
Read the sensor guideThick Film Technology Center
Thick Film Technology Center
Engineering guidance for materials, printing, thermal processing, resistor design, inspection, and RFQ planning.
Use this center to select the right circuit route, identify design inputs, understand process controls, and prepare a manufacturable thick film project.
- Material systems
- Ceramic, metal, and flexible routes
- Functional layers
- Conductor, resistor, dielectric, heater
- Project path
- Prototype review to repeat production
Start with function, not the substrate name
A thick film circuit is a printed functional system. The correct route depends on what the circuit must sense, heat, resist, interconnect, insulate, or survive after assembly.
What thick film adds to a circuit
Functional pastes are deposited on a compatible substrate and processed to form controlled electrical layers. Unlike an ordinary interconnect-only PCB, the printed stack can become part of the sensing, resistance, heating, insulation, or hybrid-assembly function.
The substrate property alone does not define the finished circuit. Paste chemistry, geometry, firing or curing, refire sequence, termination, trimming, assembly, and validation work as one system.
Choose the manufacturing route deliberately
These ceramic and printed-circuit technologies are related, but they are not interchangeable.
| Route | How the circuit is formed | When to evaluate it |
|---|---|---|
| Thick film | Functional conductor, resistor, dielectric, protective, or heater pastes are printed and thermally processed on a compatible substrate. | Integrated resistors, sensor tracks, heaters, ceramic hybrids, and application-specific functional circuits. |
| Thin film | Vacuum-deposited films are patterned with photolithographic processes. | Fine geometry, precision networks, and applications where deposited-film control is the main requirement. |
| DPC | Copper is deposited and plated on ceramic, then patterned as the interconnect system. | Dense ceramic interconnect and thermal designs that need a plated-copper route rather than printed functional pastes. |
| DBC or AMB | Copper foil is bonded to a ceramic substrate through a route selected for the ceramic and assembly. | Power electronics where copper thickness, current handling, and the thermal path dominate the architecture. |
One circuit is a compatible material system
Substrate, conductor, resistor, dielectric, protection, terminal, and assembly materials must survive the same process sequence and operating environment.
- Substrate
- Alumina is a mature fired-paste platform. AlN is reviewed when heat spreading matters. Stainless steel, aluminum, PI, and FR4 require process routes matched to their temperature and insulation limits.
- Conductor system
- Ag, Ag/Pd, Pt/Ag, Au, and project-specific systems are selected around firing compatibility, soldering or bonding, contact wear, environment, and cost.
- Resistor system
- Target value or curve, TCR, tolerance, geometry, power loading, trim allowance, and measurement conditions must be reviewed together.
- Dielectric and protection
- Crossovers, insulation, sealing, and overglaze layers are chosen as part of the same compatible stack, including the print and firing sequence.
Engineering boundary: final materials and capability are confirmed against the released drawing, selected paste system, assembly route, and validation method.
From artwork to measured function
Process control is sequential. A change in paste, screen, drying, firing, trim geometry, or test method can change the final electrical result.
- 01
Engineering review
Function, drawing, materials, assembly, environment, test method, and volume are aligned before artwork release.
- 02
Substrate preparation
Material, surface condition, outline, holes, slots, and cleanliness are checked for the selected route.
- 03
Printing and drying
Each functional layer uses controlled artwork, screen, paste, alignment, deposition, and drying conditions.
- 04
Thermal processing
Compatible layers follow their released firing or curing profile, sequence, and refire limits.
- 05
Trim and finishing
Resistance values or curves can be laser trimmed where the design provides suitable geometry and measurement access.
- 06
Inspection and release
Visual, dimensional, electrical, environmental, and documentation checks follow drawing risk and the agreed control plan.
Factory process environment
Workshop records connect the process sequence to screen printing, controlled thermal processing, and laser trimming.
Engineering review before tooling
A usable RFQ describes the finished assembly and operating condition, not only the bare circuit outline.
Electrical function
- Circuit schematic and layer artwork
- Resistance value, ratio, or output curve
- Voltage, current, power, TCR, and tolerance
- Probe method and acceptance criteria
Thermal design
- Heat source and heat-flow path
- Working and peak temperature
- Heating uniformity or heat spreading
- Thermal cycling and warm-up profile
Mechanical interface
- Outline, thickness, holes, slots, and flatness
- Terminals, connectors, soldering, or wire bonding
- Mounting pressure and contact zones
- Assembly clearance and handling areas
Operating environment
- Humidity, fuel, oil, chemicals, or cleaning
- Vibration, wear, and contact life
- Insulation and dielectric requirements
- Qualification, records, and traceability
Useful filesGerberDXFDWGPDFSTEPBOMSample photosElectrical targets
Inspection matched to circuit function
The control plan follows the drawing, measurement method, operating risk, and approval stage. A visual pass cannot replace the required electrical or environmental result.
Printed layers
Coverage, alignment, edge condition, overlap, pinholes, contamination, and pad condition
Mechanical
Outline, thickness, holes, slots, flatness, edge quality, and assembly interface
Electrical
Continuity, isolation, resistance, ratio, curve, TCR, power, or dielectric checks as specified
Reliability
Adhesion, solderability, humidity, thermal cycling, media exposure, wear, or aging selected by project risk
Release records
Drawing revision, lot identity, inspection results, sample approval, packaging, and shipment documents when required
Application engineering, not catalog substitution
Each use case changes the required geometry, contact system, thermal path, materials, validation, and assembly interface.
Heating and thermal control
Voltage, power, heat path, insulation, sensing, flow conditions, terminals, and safety targets are reviewed at assembly level.
Explore heater engineering
Hybrid ceramic modules
Printed resistors, conductor pads, die attach, wire bonding, protection, thermal behavior, and inspection access must share one released layout.
Review hybrid interfacesFollow the engineering decision path
Start with fundamentals, then move through materials and process, design and reliability, and application-specific RFQ preparation.
Fundamentals
Materials and process
Design and reliability
Application and sourcing
Technical FAQ
Fast answers for early process selection. Final values and limits follow the selected stack, geometry, assembly, and validation plan.
Open Knowledge LibraryWhat makes a circuit a thick film circuit?
Its functional layers are deposited as pastes, commonly by screen printing, then dried and fired or cured through a material-compatible process. Conductors, resistors, dielectrics, protective layers, and heaters can be integrated in the printed stack.
Is every ceramic PCB a thick film circuit?
No. Ceramic describes the substrate. Thick film, thin film, DPC, DBC, AMB, and other metallization routes create different conductor structures and design rules. The required function should select the process route.
How do engineers choose between alumina and AlN?
Alumina is a common, established thick-film platform. AlN is evaluated when the thermal path is more demanding. The final choice also depends on paste compatibility, metallization, mechanical details, assembly, reliability, availability, and cost.
Can resistance values or sensor curves be customized?
Yes, subject to engineering review. Paste family, geometry, contact design, trim allowance, probe method, operating environment, and validation plan all influence achievable value, curve, tolerance, TCR, and stability.
What should be included in an RFQ?
Send Gerber, DXF, DWG, PDF, STEP, BOM, sample photos, substrate details, electrical targets, operating conditions, assembly method, test requirements, prototype quantity, and expected annual volume when available.
Start an engineering review
Send the drawing, electrical target, material preference, operating condition, assembly method, test requirements, and quantity. If information is incomplete, clear sample photos and measured dimensions can still start the review.
- 01Upload the design
Drawing revision, sample photos, BOM, or existing failure information
- 02Define the function
Resistance, curve, heating, insulation, interconnect, or sensor requirements
- 03Confirm the use condition
Temperature, media, cycling, wear, volume, and approval needs
Submit RFQ and files
PDF, DWG, DXF, STEP, ZIP, Excel, Word, and measured sample photos are accepted.