
Material-stack compatibility
Review alumina grade and surface with conductor, resistor, dielectric, protection, terminal, cleaning, joining, and refire requirements before materials are released.

Alumina Ceramic Circuit Engineering
Custom alumina thick film PCBs can combine printed conductors, resistors, dielectric layers, protection, and assembly interfaces on a rigid ceramic substrate. Send the drawing, material requirement, artwork, electrical targets, operating conditions, joining method, quantity, and inspection plan so engineering can review the complete manufacturing route.
Twelve practical selection values cover the ceramic substrate, printed conductor and resistor systems, firing condition, geometry, finish, and dielectric strength.
Final values confirmed against customer drawing.
| Substrate Material | 96% / 99% / 99.6% Alumina / AlN |
|---|---|
| Board Thickness | 0.25–3.0 mm |
| Conductor System | Ag / Ag-Pd / Pt-Ag / Au |
| Resistor System | RuO₂ thick film |
| Conductor Thickness | 10–25 µm typical |
| Resistance Tolerance | ±1% standard (±0.5% available) |
| Firing Temperature | Up to 850°C |
|---|---|
| Thermal Conductivity | ≥24 W/m·K, 96% alumina reference |
| Minimum Line/Space | ≥100 µm |
| Board Size | Max. 120 × 120 mm; larger on request |
| Surface Finish | Bare Ag / ENIG / ENEPIG |
| Dielectric Strength | ≥15 kV/mm |
Four reviews connect the ceramic, printed materials, artwork, electrical targets, and downstream assembly to one manufacturable release. Final materials, numerical limits, and records remain controlled by the customer drawing and approved project plan.

Review alumina grade and surface with conductor, resistor, dielectric, protection, terminal, cleaning, joining, and refire requirements before materials are released.

Check common datums, line and spacing rules, overlaps, openings, edge clearances, panel orientation, print direction, and inspection access across each printed layer.

Connect electrical targets, resistor or heater duty, pad finish, joining route, housing, heat path, cleaning, coating, and rework limits to the released design.

Select visual, dimensional, electrical, adhesion, assembly, traceability, and packing checks with measurable limits, sampling, equipment, and record format.
These application directions are starting points for engineering review. Suitability depends on the released electrical, thermal, mechanical, environmental, assembly, and validation requirements.
Application illustrationAlumina circuits can be reviewed for compact resistor networks when the resistance map, tolerance, TCR, power distribution, trimming strategy, terminals, environment, and test method are drawing-defined.
Review resistor inputs
Application illustrationHeater layouts require voltage, power, target temperature, heat-transfer boundary, resistance tolerance, sensor interface, mounting, insulation, cycling, and safety criteria before the printed route is selected.
Review heater inputs
Application illustrationPrinted tracks and terminal patterns may support sensor or control functions after travel, contact system, resistance curve, signal level, wear, media exposure, connector duty, and calibration requirements are released.
Review sensor inputsThe available views show an eight-position alumina panel with printed routes, white terminal areas, dark functional regions, blue features, green coverage, and visible ceramic edges. They support review of visible form only; they do not establish material purity, printed chemistry, dimensions, electrical results, lot identity, inspection records, or shipment traceability.


Company resources support thick film screen printing, controlled firing, route-dependent resistor trimming, and final inspection. The applicable materials, artwork, thermal profile, trimming method, electrical checks, sampling, traceability, and acceptance records are confirmed for each released alumina circuit project.
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Short answers for quotation planning; released drawings and validation requirements remain controlling.
Send the dimensioned drawing and artwork, alumina grade or required material data, thickness, conductor and functional-layer notes, electrical targets, assembly method, operating conditions, inspection criteria, quantity, schedule, and required records. PDF, Gerber, DXF, DWG, STEP, Excel, and clear sample photographs can support the first review.
They can be evaluated as a compatible project stack. The conductor, resistor, dielectric, protection, and terminal systems must match the selected alumina surface, print sequence, firing route, electrical duty, joining process, and validation method. A photograph or generic material name is not enough to release the construction.
The drawing should identify resistor geometry, target values, tolerance, TCR, power loading, test temperature, measurement points, and whether trimming is permitted. Engineering then reviews paste family, artwork allowance, firing interactions, trimming access, probe method, sampling, and the acceptance record required for the order.
Visual and dimensional checks form the usual starting point. Continuity, resistance, isolation, adhesion, solderability, wire-bond evaluation, thermal checks, traceability, and packing records can be added when the released drawing and purchase requirements define the method, sample size, limits, and document format.
Send enough information to connect the alumina substrate, printed stack, artwork, electrical function, assembly method, operating environment, inspection plan, and order scope. Clear sample photographs can begin a review when final CAD data is not ready.
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.
