Jumper material and stack
Confirm FR-4 and copper construction, carbon system, printed film build, cure, any insulating layer beneath the jumper, and protection above exposed or non-contact areas.
Printed carbon crossover circuit
Carbon Ink Jumper PCB
Carbon ink jumper PCBs use a printed carbon path to connect drawing-selected nodes on an FR-4 circuit where the artwork and electrical duty suit the material system. Chipsimple reviews jumper geometry, copper overlap, underlying insulation, resistance, current, voltage, cure, protection, spacing, and test limits before release.
- Artwork-defined printed jumper paths
- Copper overlap and insulation reviewed
- Resistance and current limited by design
- Open, short, and isolation tests planned
FR-4Base circuit
120–150°CCure typical
5Verified views, one detail crop
By loadFinal jumper release
On this pageOverview
Quick Specifications
The FR-4 carbon-film values below support early route selection. Jumper ink, film build, path geometry, overlap, underlying dielectric or mask, resistance, current, voltage, spacing, protection, cure, and inspection are confirmed for the released circuit and operating conditions.
Final values confirmed against customer drawing.
| Base Material | FR-4 |
|---|---|
| Board Thickness | 0.4–3.2 mm typical |
| Copper Weight | 0.5–2 oz typical |
| Carbon Ink | Polymer carbon / Ag-C blend |
| Carbon Film Thickness | 8–15 µm typical |
| Cure Temperature | 120–150°C typical |
| Sheet Resistance | 50–5,000 Ω/□/25 µm reference |
|---|---|
| Target Resistance | 10 Ω–1 MΩ typical |
| Resistance Tolerance | ±5% / ±10% typical |
| Linearity | ±1–5% FS typical |
| Surface Finish | HASL / ENIG / ENEPIG |
| Wear Life | ≥10,000 cycles typical |
Engineering Capabilities
A reliable printed jumper depends on the complete current path and isolation structure. Engineering review connects carbon sheet resistance, path aspect ratio, copper overlap, surface finish, underlying mask or dielectric, adjacent-node voltage, current and duty, heat rise, contamination, cure, protection, and the electrical test method.
Path, overlap, and spacing
Release jumper width and length, copper landing overlap, crossings, keep-outs, adjacent-node spacing, mask openings, and registration tolerances in controlled artwork.
Electrical and thermal duty
Define target resistance or maximum drop, current, voltage, duty cycle, ambient temperature, allowable heat rise, fault condition, and any downstream soldering or cleaning exposure.
Continuity and isolation tests
Specify resistance, continuity, open/short, adjacent-net isolation, visual coverage, adhesion, environment, sampling, fixture, current, and acceptance limits for release.
Typical Applications
Printed jumpers can simplify selected low-current routing when the board stack, isolation, voltage, thermal behavior, and electrical test are compatible with the application.
Application illustrationCompact industrial control boards
Printed jumpers may support constrained routing after node voltage, current, isolation, enclosure contamination, assembly heat, and field-duty requirements are reviewed.
Review application inputs
Application illustrationAppliance control circuits
Low-current appliance controls can be evaluated when moisture, cleaning, mains separation, temperature, soldering, fault behavior, and safety requirements are defined.
Review application inputs
Application illustrationInstrument interface boards
Compact instrument circuits require controlled voltage, leakage, cleaning, material declaration, inspection, and risk-based validation before a printed jumper route is approved.
Review application inputsVerified Product Views
Four unique supplied photographs and one controlled detail crop show real FR-4 boards with black printed jumper paths, conductor interfaces, pads, holes, and several geometries. They do not prove net assignment, insulation beneath a crossing, resistance, current rating, voltage isolation, adhesion, or lifecycle performance.
- Visible path
- Printed black jumper geometry, conductor interfaces, pads, and board features are directly visible.
- Net boundary
- Photographs cannot identify circuit nets, crossing insulation, polarity, or functional connectivity.
- Load boundary
- Resistance, voltage drop, current, heat rise, and fault behavior depend on material and geometry.
- Isolation boundary
- Spacing, dielectric structure, leakage, and withstand requirements are released from the electrical design and test plan.
Manufacturing & Quality
Chipsimple supports polymer-carbon printing, laboratory inspection, managed production, and protected packing in Dongguan. Jumper projects release the board stack, artwork, carbon and insulating systems, cure route, electrical test, sampling, traceability, and acceptance criteria together; current and isolation capability remain project-specific.
View Full Capabilities
Technical FAQ
Short answers for quotation planning; released drawings and validation requirements remain controlling.
What should be defined first for a custom Carbon Ink Jumper PCB?
Define the connected nets, path and crossing artwork, board stack, copper finish, underlying insulation, carbon system, target or maximum resistance, current, voltage, duty cycle, spacing, allowable heat rise, protection, soldering and cleaning exposure, environment, and electrical test limits before selecting this route.
Are the quick specification values guaranteed for every design?
No. They are practical category-level selection values, not a released product specification. Material compatibility, geometry, print build, electrical loading, assembly, environment, inspection method, and expected volume can narrow the usable window. Final values are confirmed against the controlled drawing and approved project conditions.
How should Carbon Ink Jumper PCB performance be validated?
Verify visual coverage and registration, jumper resistance and continuity, open/short behavior, adjacent-net isolation, voltage drop or heat rise at the released load, adhesion, assembly exposure, and project-selected temperature or humidity tests. Use controlled fixtures, conditioning, sample sizes, and failure limits.
What should be included with an RFQ?
Send the controlled drawing or artwork, dimensions and tolerances, material preference, electrical targets, assembly interface, operating environment, validation requirements, prototype quantity, annual volume, and schedule. Identify every connected net and crossing, the insulating structure, maximum resistance, current, voltage, duty, and isolation test.
Request a Carbon Ink Jumper PCB Quote
Send the board data with net assignments and electrical duty so the jumper path, copper overlap, isolation stack, current, resistance, voltage, protection, cure, and test route can be assessed. A printed crossover should be approved from circuit risk, not selected from appearance alone.
- Drawing-led DFM and material-route feedback
- Prototype and repeat-production route review
- Confidential handling of customer files
- Project-specific inspection and validation planning
- Gerber, drill, stack-up, outline, and net identification
- Copper weight, finish, mask, dielectric, and crossing structure
- Carbon system, path dimensions, overlaps, and cure limits
- Target or maximum resistance and voltage drop
- Current, voltage, duty cycle, ambient, and heat-rise limit
- Isolation, open/short, adhesion, and environmental tests
- Quantity, schedule, sampling, traceability, and packing
- 1We review the drawing, application, material route, and missing acceptance inputs.
- 2You receive DFM questions and a prototype route for approval.
- 3Repeat production follows the released revision, inspection plan, and packing requirement.
Submit RFQ and upload files
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.