Matched resistor architecture
Select ceramic, resistor paste ranges, conductor system, printed sequence, protection, and compatible trim route to support the absolute values and ratio.
Matched printed resistor divider
Thick Film Voltage Divider
Thick film voltage dividers integrate two or more drawing-defined resistors on ceramic to scale a voltage through a controlled ratio. Chipsimple reviews input and output voltage, ratio, absolute values, tolerance, TCR tracking, loading, leakage, trim sequence, spacing, terminals, protection, mounting, environment, calibration, and test safety together.
- Ratio and absolute values reviewed together
- TCR tracking and loading included
- High-voltage spacing and protection coordinated
- Trim, calibration, and safe test planning
- Ratio-defined
- Primary electrical function
- Passive / active
- Trim routes
- 5
- Verified product views
- By voltage
- Final divider release
Product Categories
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Verified capability review
Quick Specifications
Thick Film Voltage Divider is shown against approved company capability control sheets.
Capability source: approved company category control sheets. Final values remain drawing- and sample-controlled.
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Substrate / Thickness | 96% / 99% Alumina / AlN; 0.25–3.0 mm | 96%/99% alumina or AlN within 0.25–3.0 mm, selected for thermal path, voltage, flatness, assembly, and firing | Approved material specification, drawing, and incoming criteria |
| Resistor System | RuO₂ / Cermet | RuO₂ or cermet selected for value, sheet resistance, TCR, load, stability, conductor, and firing compatibility | Released drawing and approved sample |
| Sheet Resistance | 1 Ω/□–1 MΩ/□ paste-family reference | Select within the 1 Ω/□–1 MΩ/□ paste-family reference after value, geometry, aspect ratio, and trim review | Released electrical limits, measurement method, and approved sample |
| Conductor System | Ag / Ag-Pd / Au | Ag, Ag-Pd, or Au selected for termination, bonding, soldering, voltage, environment, and firing | Approved material stack, assembly interface, and sample |
| Resistor Film Thickness | 8–15 µm fired typical | Within 8–15 µm fired typical, print build, firing, geometry, value distribution, and trimming are controlled | Released drawing, DFM approval, and first-article inspection |
| Firing Temperature | Up to 850°C | Peak up to 850°C; the actual profile, atmosphere, dwell, and refire sequence follow the selected paste system | Approved material-process route and production traveler |
View 6 additional engineering review checks
| Parameter | Standard capability | Engineering review range | Final release |
|---|---|---|---|
| Resistance Value | 10 Ω–10 MΩ typical | Within 10 Ω–10 MΩ typical, nominal, ratio, reference temperature, voltage, and measurement method are defined | Released electrical limits, measurement method, and approved sample |
| Resistance Tolerance | ±1% standard | ±0.5% available after paste, geometry, trim allowance, TCR, stability, and measurement review | Released electrical limits, measurement method, and approved sample |
| TCR | ±100–200 ppm/°C typical | Within ±100–200 ppm/°C typical, define temperature interval, tracking, stabilization, and measurement method | Released electrical limits, measurement method, and approved sample |
| Laser Trimming | Passive / Active | Passive or active trimming with approved kerf, cut geometry, stopping rule, test condition, and post-trim protection | Released drawing and approved sample |
| Power / Working Voltage | By geometry and thermal design | Released from geometry, substrate, heat path, ambient, duty, pulse, clearance, field grading, and protection | Approved electrical-thermal design and instrumented prototype validation |
| Protection | Glass overglaze / Passivation | Glass overglaze or passivation selected for trim access, assembly, moisture, contamination, voltage, and temperature | Approved material stack, assembly interface, and sample |
Engineering Capabilities
A voltage divider is evaluated as a ratio network under the real electrical load. Engineering connects resistor paste families and geometry, voltage distribution, ratio and TCR tracking, conductor and terminal resistance, trim sequence, leakage, measurement impedance, power and self-heating, creepage, protection, mounting, environment, calibration, and guarded high-voltage testing.
Ratio and voltage geometry
Release each resistor, common node, input and output terminals, trim areas, probe pads, spacing, creepage, edge distances, protection windows, and datums.
Loading and calibration
Define input and output voltage, source impedance, measurement load, ratio, absolute values, tolerance, TCR tracking, power, leakage, mounting, and calibration conditions.
Trim and divider validation
Specify passive or active trim order, guarded measurement, stabilization, ratio calculation, working-voltage test, leakage, temperature, environment, sampling, data, and limits.
Typical Applications
Printed dividers support high-voltage sensing, monitoring, feedback, and calibration when ratio loading, insulation environment, mounting, and measurement safety are fully defined.
Application images are engineering illustrations, not customer projects, production records, or evidence of a released design. Suitability is confirmed only after the drawing, interfaces, operating conditions, risks, and validation plan are reviewed.
Application illustrationPower-system voltage sensing
Power equipment needs released input waveform, ratio, measurement loading, isolation, creepage, transients, derating, calibration, and safe test requirements.
Review application inputs
Application illustrationPrecision instrumentation
Measurement systems require controlled ratio error, TCR tracking, source and load impedance, leakage, shielding, calibration, cleanliness, and traceability.
Review application inputs
Application illustrationIndustrial monitoring
Control modules need application-specific voltage, transients, loading, enclosure, contamination, mounting, temperature, calibration, and field-safety validation.
Review application inputsVerified Product Views
The verified photographs show real octagonal or ring-like green ceramic divider substrates with paired black resistor regions, conductor paths, terminals, central openings, and repeated layouts. Surface geometry does not prove absolute values, ratio, TCR tracking, trim status, input voltage, loading, leakage, protection, calibration, or reliability.
- Visible architecture
- Paired resistor regions, conductor nodes, terminals, central openings, and repeated ceramic outlines are visible.
- Ratio boundary
- Absolute values, ratio, tolerance, TCR tracking, and trim status require controlled measurement and records.
View 2 additional evidence boundaries
- Voltage boundary
- Input voltage, transients, leakage, spacing, and protection depend on the released circuit and environment.
- Loading boundary
- Output accuracy depends on source, measurement impedance, self-heating, mounting, temperature, and calibration.
Manufacturing & Quality
Chipsimple supports resistor printing, controlled firing, laser trimming, and laboratory inspection in Dongguan.
Read the shared manufacturing-control scope
Divider projects release the schematic, values and ratio, trim order, guarded voltage fixture, loading, calibration, protection, sampling, traceability, and acceptance records together; final accuracy and voltage ratings depend on approved conditions.
Technical FAQ
Short answers for quotation planning; released drawings and validation requirements remain controlling.
What should be defined first for a custom Thick Film Voltage Divider?
Define input and output voltage, waveform and transients, divider ratio, absolute resistance values, tolerance, TCR and tracking, source and measurement impedance, loading, leakage, power, trim method, terminals, spacing, protection, mounting, temperature, humidity, altitude, calibration, derating, and test safety.
Are the quick specification values guaranteed for every design?
No. They are practical category-level selection values, not a released product specification. Material compatibility, geometry, print build, electrical loading, assembly, environment, inspection method, and expected volume can narrow the usable window. Final values are confirmed against the controlled drawing and approved project conditions.
How should Thick Film Voltage Divider performance be validated?
Measure absolute values and ratio under controlled source voltage, load impedance, probe points, stabilization, and temperature. Include trim verification, working-voltage and transient behavior, leakage, self-heating, TCR tracking, humidity or contamination, calibration, guarded fixtures, sampling, data retention, and failure limits.
What should be included with an RFQ?
Send the controlled drawing or artwork, dimensions and tolerances, material preference, electrical targets, assembly interface, operating environment, validation requirements, prototype quantity, annual volume, and schedule. Include input and output voltage, waveform, ratio and absolute values, source and load impedance, TCR tracking, trim order, protection, calibration, and guarded test limits.
Request a Thick Film Voltage Divider Quote
Send the complete divider circuit and measurement conditions. Ratio, absolute values, source and load impedance, input waveform, transients, TCR tracking, trim, spacing, protection, mounting, calibration, and guarded testing determine the manufacturable and safe release route.
RFQ inputs and review sequence
- Drawing-led DFM and material-route feedback
- Prototype and repeat-production route review
- Confidential handling of customer files
- Project-specific inspection and validation planning
- Controlled divider schematic, artwork, nodes, and revision
- Ceramic, outline, terminals, holes, spacing, and protection
- Absolute values, ratio, tolerance, TCR, and tracking
- Input and output voltage, waveform, transients, and derating
- Source and load impedance, leakage, power, and self-heating
- Trim, guarded measurement, calibration, environment, and stability
- Quantity, schedule, sampling, traceability, and packing
- 1We review the drawing, application, material route, and missing acceptance inputs.
- 2You receive DFM questions and a prototype route for approval.
- 3Repeat production follows the released revision, inspection plan, and packing requirement.
Submit RFQ and upload files
PDF, DWG, DXF, STEP, Gerber, ZIP, Excel, Word, or sample photos are accepted.
The drawing-upload form loads as you reach this section.