Material route
Alumina, AlN, stainless steel, aluminum, PI, FR4, conductor paste, resistor paste, dielectric, and protective glass review.
Chipsimple
Thick Film Circuit Manufacturing Capabilities
Custom thick film circuit manufacturing capability with material, design, process, and quality verification support.
Thick film circuit manufacturing capabilities
Manufacturing support for custom thick film PCB, ceramic circuits, printed resistor tracks, sensor elements, heater circuits, and hybrid substrates from drawing review to repeat production.
Functional design
Resistance value, custom curve, heater zone, sensor track, terminal layout, mounting method, voltage, and power check.
Process control
Screen design, printing, drying, firing, laser trimming, scribing, laser processing, and dimensional inspection.
Quality verification
Visual inspection, resistance test, curve check, insulation, dielectric withstand, adhesion, aging, packaging, and traceability.
Applications we can review
Automotive sensor circuits
Fuel level sensor cards, fuel gauge resistor tracks, throttle position sensors, oil level circuits, and rotary position feedback parts.
Thick film heaters
Stainless steel heaters, ceramic heaters, aluminum substrate heaters, flexible heaters, appliance heating plates, and compact thermal modules.
Ceramic PCB and power substrates
Alumina and AlN thick film ceramic PCB for power electronics, RF communication, medical devices, industrial control, and harsh environments.
Hybrid circuit interfaces
Solder pads, die attach areas, wire bonding pads, conformal coating windows, downstream assembly, and functional test requirements.
RFQ information that improves accuracy
- Drawing files, Gerber, DXF, DWG, PDF, STEP, sample photos, or existing product samples.
- Substrate material, dimensions, thickness, mounting holes, slots, edge profile, and tolerance requirements.
- Resistance value, resistance curve, TCR, voltage, current, power, heating target, and operating temperature.
- Environmental and test requirements such as humidity, fuel or oil exposure, thermal cycling, vibration, insulation, adhesion, or lot traceability.
- Prototype quantity, estimated annual volume, target lead time, and packaging requirement.