PI Flexible Position Sensor
Printed sensor and collector tracks coordinated with active travel, support, wiper, connector, bend condition, and validation.
Open product pageLow-temperature printed circuit route
Flexible & Polymer Thick Film Circuits
Polymer thick film materials are printed and cured on a compatible flexible or rigid substrate. Ink, film, layer interfaces, bend condition, contact system, adhesive, connector, environment, and life target govern the design.
Route definition
What is fixed before quotation
- Substrate
- Specified PI, PET, FR4, or another surface qualified for the selected polymer ink and cure
- Printed functions
- Conductors, resistors, sensor tracks, contacts, selected heater patterns, and protective layers
- Mechanical inputs
- Static bend, dynamic flex, bend radius, support, stiffener, connector, adhesive, and assembly pressure
- Verification
- Electrical function before and after project-selected bend, wear, humidity, temperature, chemical, and life exposure
Released product pages
Choose the closest engineering route
Start from the nearest product family, then confirm the drawing, material system, operating conditions, and required evidence.
Custom Polymer Thick Film Circuit
Conductive, resistive, contact, or sensor functions printed on a substrate and cure route selected for the assembly.
Open product pageRFQ checklist
Put these items on the drawing or RFQ
- 01
Film material, thickness, outline, holes, datums, support, bend direction, and minimum bend radius
- 02
Separate artwork for conductors, resistors, contacts, protection, adhesive, and keep-outs
- 03
Resistance or curve targets, current, voltage, heating load, contact, and measurement method
- 04
Connector, tail, stiffener, adhesive, housing, wiper, and assembly-pressure interfaces
- 05
Flex duty, temperature, humidity, chemicals, abrasion, lifetime, quantity, and inspection requirements
Typical programme fit
Applications we can review
- Compact position and travel sensing
- Flexible printed resistors and contact elements
- Conformable interconnect and functional printed circuits
- Thin assemblies with integrated adhesive, tail, or stiffener features
Suitability and performance are confirmed from the complete assembly and validation conditions, not the application name alone.
Engineering references
Read before releasing the drawing
Printing and curing polymer pastesControl handling, deposition, cure, adhesion, and electrical verification as one route.Migration in flexible circuitsManage moisture, bias, spacing, cleanliness, and protection.Rheology and print formationUnderstand how the paste and print setup form the released geometry.