Alumina Thick Film PCB
A balanced fired-ceramic route for printed conductors, resistors, dielectric features, and hybrid assembly interfaces.
Open product pageCeramic circuit manufacturing route
Thick Film Ceramic Circuits
Printed conductor, resistor, dielectric, crossover, via, and protective layers are reviewed as one fired material stack on alumina or selected aluminum nitride substrates.
Route definition
What is fixed before quotation
- Common substrates
- Alumina; selected AlN grades after paste and firing compatibility review
- Printed functions
- Conductors, resistors, dielectrics, overglaze, crossovers, and via structures
- Process branch
- Screen print, dry, material-specific firing, optional laser trim, and electrical inspection
- Release basis
- Approved layer artwork, stack sequence, assembly interface, and inspection plan
Released product pages
Choose the closest engineering route
Start from the nearest product family, then confirm the drawing, material system, operating conditions, and required evidence.
AlN Thick Film PCB
A thermal-management route reviewed around the specified AlN grade, metallization, attachment, and operating condition.
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Thick Film Hybrid Circuit
Printed ceramic functions prepared for die, wire, component, terminal, or housing integration.
Open product pageMultilayer Ceramic Circuit
Repeated conductor and dielectric layers for compact routing where the complete firing sequence is compatible.
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Dielectric Crossover Circuit
Local insulation and conductor overpasses controlled by overlap, registration, isolation, and test requirements.
Open product pageRFQ checklist
Put these items on the drawing or RFQ
- 01
Ceramic material, grade, thickness, outline, holes, slots, and datum scheme
- 02
Layer-by-layer artwork and print or firing order
- 03
Electrical targets, loading, reference temperature, and test method
- 04
Soldering, wire bonding, die attach, terminals, coating, and housing interfaces
- 05
Environment, reliability plan, quantity, revision, and traceability needs
Typical programme fit
Applications we can review
- Hybrid microelectronics and industrial control
- Power and thermal-management assemblies
- Medical, sensing, and measurement modules
- High-temperature or chemically exposed electronics
Suitability and performance are confirmed from the complete assembly and validation conditions, not the application name alone.
From design choice to a quoted part
Drawing-specific ceramic circuits with printed conductors and, where required, integrated resistors, dielectric crossovers or vias. Bare printed substrates and assembly requirements are quoted as separate scopes.
Prepare the drawing review
Send layer artwork, outline and holes, schematic, material preference, electrical limits, assembly method, sample quantity and expected repeat volume.
Send Drawings- Choose the substrate
- Start with the specified alumina grade; review AlN when the complete thermal budget justifies its material and metallization route.
- Define the layer stack
- Provide separate conductor, resistor, dielectric and protection artwork, including front-to-back connections and exposed assembly interfaces.
- Agree sample acceptance
- Name dimensional, resistance, isolation and assembly-interface checks before tooling. Batch release follows the approved drawing and inspection plan.
Review with your project filesDFM checklistManufacturing and inspectionCompany and document evidence
Engineering reading for this purchase
- When a Ceramic Circuit Needs Two-Sided Routing Instead of Jumpers
Compare crossover count, current paths, thermal exposure, access and inspection before replacing jumper routing with a two-sided ceramic circuit.
- Designing Thick-Film Current Paths Without Borrowing FR4 Trace Rules
Size and validate printed ceramic current paths from processed sheet resistance, geometry, interfaces and thermal boundary conditions.
- Selecting Assembly Order for Access-Sensitive Ceramic Modules
Sequence die attach, passive placement, wire bonding, cleaning, coating and enclosure steps around access, contamination and rework constraints.
Engineering references