Ceramic thick film heat dissipation plate for LED lighting and thermal management applications.
- Customized design and manufacturing support
- Drawing, sample, or application requirement review
- Suitable for OEM and batch production projects
- Contact Chipsimple for material, size, resistance, and lead time evaluation
Technical Parameters
Product review data
Substrate / MaterialCeramic heat dissipation substrate
CustomizationSize, layout, resistance, power, terminal, and test requirements by project
Typical ApplicationLED lighting and thermal management modules
Review DataDrawing, sample, substrate, dimensions, quantity, working conditions, and target lead time.
