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Engineering Library

Practical guidance for ceramic circuits, materials, manufacturing and design.

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Quality and application guides

Technical resources for substrate selection, manufacturing, applications, design, quality, sourcing, and supporting documentation.

90
  1. Ceramic Cross-Sections: Correct Apparent Thickness from an Oblique CutQuality & TestingQuality guide
  2. Resistance Sampling Order: Separate Warm-Up Drift from Tray PositionQuality & TestingQuality guide
  3. Thickness Maps: Choose Locations That Can Reveal Edge and Center DifferencesQuality & TestingQuality guide
  4. Heater Mapping Samples: Rotate Fixtures to Separate Product and Camera BiasQuality & TestingQuality guide
  5. Heater Power-Cycling Controls: Separate Electrical Stress from Thermal ExposureQuality & TestingQuality guide
  6. Chemical Compatibility Coupons: Control Exposed Edge Area as Well as Face AreaQuality & TestingQuality guide
  7. Cross-Section Location Plans: Do Not Miss a Small Via Defect with One CutQuality & TestingQuality guide
  8. Resistance Test Uncertainty: Reading Error, Range Error and ResolutionQuality & TestingQuality guide
  9. TCR Uncertainty When Temperature and Resistance Errors Are CorrelatedQuality & TestingQuality guide
  10. Thickness Measurement Uncertainty: Include Reference-Plane TiltQuality & TestingQuality guide
  11. Via-Chain Resistance: Move Sense Boundaries Before Subtracting Access LossQuality & TestingQuality guide
  12. Insulation Resistance Reports: Propagate Voltage and Current UncertaintyQuality & TestingQuality guide
  13. Withstand Test Records: Verify Delivered Voltage During Current LimitingQuality & TestingQuality guide
  14. Power-Cycling Data: Account for Missing Cycles and Interrupted TestsQuality & TestingQuality guide
  15. Terminal Pull Tests: Compare Actual Loading Rate, Not Crosshead Speed AloneQuality & TestingQuality guide
  16. Exposure Weighing Queues: Separate Evaporation Rate from Specimen DifferencesQuality & TestingQuality guide
  17. Microscope Calibration Grids: Detect Shear Before Measuring Diagonal FeaturesQuality & TestingQuality guide
  18. Printed Resistor Acceptance: Rounding Cannot Decide a Borderline ResultQuality & TestingQuality guide
  19. TCR Qualification: Separate Reversible Drift from Return-to-Reference ShiftQuality & TestingQuality guide
  20. HiPot Retesting and Cumulative Stress HistoryQuality & TestingQuality guide