Engineering Library

Practical guidance for ceramic circuits, materials, manufacturing and design.

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Technology & Design

Design methods, materials, calculations, and engineering references.

401
  1. Conductive Epoxy Joints: Bondline Control and Dispense VariationTechnology & DesignDesign guide
  2. Solder Joints on Ceramic: Expansion Mismatch and Strain ReliefTechnology & DesignDesign guide
  3. Glass wetting and resistor-conductor contact during firingTechnology & DesignDesign guide
  4. Returned Thick Film Paste: Preserve Exposure History Across ContainersTechnology & DesignDesign guide
  5. Refiring Thick Film Circuits: Resistance Drift and Layer CompatibilityTechnology & DesignDesign guide
  6. Low resistance versus exposure and soldering constraintsTechnology & DesignDesign guide
  7. Bondable area versus gold-covered routing areaTechnology & DesignDesign guide
  8. Printed Resistor AC Impedance: Resistance, Reactance and Fixture BoundariesTechnology & DesignDesign guide
  9. Alumina Dielectric-Loss Budgets Before a Purity UpgradeTechnology & DesignDesign guide
  10. High thermal conductivity versus complete assembly constraintsTechnology & DesignDesign guide
  11. Stronger attachment versus stress concentrationTechnology & DesignDesign guide
  12. Solderability Witness Coupons: When They Can Represent Ceramic PadsTechnology & DesignDesign guide
  13. Compliant lead length versus compact attachmentTechnology & DesignDesign guide
  14. Glass-Transition Reports: Compare the Method Before Comparing the MaterialTechnology & DesignDesign guide
  15. Shared Thick Film Furnaces: Material Carryover and Changeover QualificationTechnology & DesignDesign guide
  16. Pinholes distinguished from edge-coverage leakageTechnology & DesignDesign guide
  17. Ceramic Strength Scaling: Use the Stressed Region, Not the OutlineTechnology & DesignDesign guide
  18. Scratch or Crack on an Intact Alumina Substrate?Technology & DesignDesign guide
  19. Wire break versus bond lift versus pad peelTechnology & DesignDesign guide
  20. Pressure-Sensitive Conductive Epoxy Joints: Separating Joint Response from Probe MotionTechnology & DesignDesign guide