Engineering articles are organized into five working subjects for design review and sourcing. Dates reflect the factual online publication and review records; they are not artificially staggered for search presentation.
Ten articles are listed per page. Product limits and acceptance values remain tied to the released drawing, selected material system, assembly, and agreed inspection plan.
Ruthenium-oxide resistor pastes create a controllable conducting network inside a glassy fired matrix. Sheet resistance, TCR, noise and stability emerge from that microstructure and its interaction with geometry and firing.
Printed dielectrics can isolate conductor layers, form crossovers, protect sensitive regions and shape electric fields. Material selection must balance insulation, printability, firing compatibility, thermal expansion and later assembly exposure.
Substrate cleaning is a small process step with a large downstream effect. Residues, particles and handling marks can disturb paste wetting, print definition, adhesion, dielectric isolation and wire-bond or solder yield.
A decision guide for comparing alumina and aluminum nitride by thermal path, electrical insulation, metallization compatibility, mechanical design, supply, and validation needs.
A hold-and-release method for conductive silver paste after extended storage, covering traceability, appearance, mixing response, print coupons, cure, and electrical comparison.
A practical classification of thick-film pastes by electrical function, substrate, thermal route, and final assembly requirement—without treating unlike material systems as interchangeable.
A material-system guide to resistor functional phase, glass, vehicle, paste decade, conductor interfaces, firing, TCR, stability, load, and laser trimming.
Screen printing creates a thick-film pattern by controlling how paste fills screen openings, contacts the substrate and releases as the screen separates. Good transfer is a timed mechanical event, not simply paste pushed through mesh.
Mesh, emulsion, squeegee and snap-off form one printing system. Changing any one alters deposit volume, edge definition, release and screen life, so process limits should be qualified as combinations rather than isolated settings.
Wet, dried and fired thick-film deposits are different physical structures. Solvent loss, organic burnout, particle packing and sintering reduce thickness and change surface profile, so the final film cannot be predicted from one wet measurement.