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Engineering Library

Practical guidance for ceramic circuits, materials, manufacturing and design.

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Technical resources
776
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201–220

Further engineering design guides

Technical resources for substrate selection, manufacturing, applications, design, quality, sourcing, and supporting documentation.

311
  1. Selecting an interface using matched paste and ceramic evidenceTechnology & DesignDesign guide
  2. Selecting a finish from alloy and dwell requirementsTechnology & DesignDesign guide
  3. Selecting finish by wire and bonding processTechnology & DesignDesign guide
  4. Selecting adhesive from conductivity and attachment requirementsTechnology & DesignDesign guide
  5. Selecting a handling window from supplier viscosity conditionsTechnology & DesignDesign guide
  6. Alumina Open Porosity: Interpret Dry, Saturated and Suspended MassesTechnology & DesignDesign guide
  7. Alumina Grain Structure and Surface Defects in Fine Thick Film FeaturesTechnology & DesignDesign guide
  8. Conductive Adhesive Attachments: Separate Creep from Force RelaxationTechnology & DesignDesign guide
  9. Gold Interconnect De-Embedding with a Finite-Resistance ControlTechnology & DesignDesign guide
  10. Uncovered window allowance after dispensing tolerancesTechnology & DesignDesign guide
  11. Ceramic Curvature Changes: When a Film-Stress Calculation Is IdentifiableTechnology & DesignDesign guide
  12. Conductive Adhesive Thermal Resistance: Bondline Area and VoidsTechnology & DesignDesign guide
  13. Solder-Joint Resistance on Ceramic: Bulk Estimate and Current ConstrictionTechnology & DesignDesign guide
  14. Paste Inventory Reconciliation: Issued, Returned and Unaccounted MassTechnology & DesignDesign guide
  15. Overglaze Edge Lift: Locate the Separation Before Changing the ProcessTechnology & DesignDesign guide
  16. Glass wetting and resistor-conductor contact during firingTechnology & DesignDesign guide
  17. Returned Thick Film Paste: Preserve Exposure History Across ContainersTechnology & DesignDesign guide
  18. Low resistance versus exposure and soldering constraintsTechnology & DesignDesign guide
  19. Bondable area versus gold-covered routing areaTechnology & DesignDesign guide
  20. Printed Resistor AC Impedance: Resistance, Reactance and Fixture BoundariesTechnology & DesignDesign guide