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Engineering Library

Practical guidance for ceramic circuits, materials, manufacturing and design.

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Technical resources
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Technology & Design

Design methods, materials, calculations, and engineering references.

386
  1. Miniature Thick Film Circuits: Feature Tolerances and InspectabilityTechnology & DesignDesign guide
  2. Double-Sided Ceramic Coordinates: Define the Mirror Before Locating FeaturesTechnology & DesignDesign guide
  3. Multilayer Circuit Test Coverage: Accessible Nodes and Hidden OpensTechnology & DesignDesign guide
  4. Wraparound Edge Terminations: Include the Curved Path and Narrowest SectionTechnology & DesignDesign guide
  5. Wire-Bond Pad Allocation: Capillary Clearance and Placement ErrorTechnology & DesignDesign guide
  6. Edge-Cooled Ceramic Circuits: Lateral Heat Paths to ClampsTechnology & DesignDesign guide
  7. Repeated Dielectric Crossovers: Accumulated Capacitance on One NetTechnology & DesignDesign guide
  8. Miniature Circuit Inspection: Object-Space Pixels and Defect VisibilityTechnology & DesignDesign guide
  9. Second-Side Ceramic Assembly: Retaining Inverted Components During ReflowTechnology & DesignDesign guide
  10. Via Metallization Process Interactions: Cleaning, Drying and FiringTechnology & DesignDesign guide
  11. Edge Termination Deposition: Finding Fixture-Shadow GapsTechnology & DesignDesign guide
  12. Repeated Soldering on Thick Film Pads: Leaching and Rework LimitsTechnology & DesignDesign guide
  13. Die-Attach Resin Bleed: Protecting Adjacent Wire-Bond RegionsTechnology & DesignDesign guide
  14. Ceramic Thermal Paths After Assembly: Where Interface Losses AppearTechnology & DesignDesign guide
  15. Printing Direction and Narrow-Line Continuity on Ceramic CircuitsTechnology & DesignDesign guide
  16. Via-Fill Drying Recession and Refill Sequence on Ceramic CircuitsTechnology & DesignDesign guide
  17. Ceramic Circuit Enclosures: Trapped-Gas Pressure After Lid ClosureTechnology & DesignDesign guide
  18. Miniature Ceramic Panels: Fixture Release and Transfer DamageTechnology & DesignDesign guide
  19. Ceramic Via Arrays: Redundancy, Land Area and Test AccessTechnology & DesignDesign guide
  20. Solid Ground Plane or Separated Returns? Follow the Actual CurrentTechnology & DesignDesign guide