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Engineering Library

Practical guidance for ceramic circuits, materials, manufacturing and design.

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Technical resources
776
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Technology & Design

Design methods, materials, calculations, and engineering references.

401
  1. Alumina Open Porosity: Interpret Dry, Saturated and Suspended MassesTechnology & DesignDesign guide
  2. Alumina Grain Structure and Surface Defects in Fine Thick Film FeaturesTechnology & DesignDesign guide
  3. AlN Substrate Thickness: Thermal Benefit and Mechanical Trade-OffTechnology & DesignDesign guide
  4. Solderable Thick Film Terminations: Wetting Area and Joint VolumeTechnology & DesignDesign guide
  5. Conductive Adhesive Attachments: Separate Creep from Force RelaxationTechnology & DesignDesign guide
  6. Glass Phase in Thick Film Layers: Adhesion and Residual StressTechnology & DesignDesign guide
  7. Paste Recovery Measurements: Wall Slip, Pre-Shear and ComparabilityTechnology & DesignDesign guide
  8. Paste Container Warm-Up: Dew Point and Opening ReadinessTechnology & DesignDesign guide
  9. Firing Compatibility: Building a Cumulative Thermal BudgetTechnology & DesignDesign guide
  10. Gold Interconnect De-Embedding with a Finite-Resistance ControlTechnology & DesignDesign guide
  11. Uncovered window allowance after dispensing tolerancesTechnology & DesignDesign guide
  12. Ceramic Curvature Changes: When a Film-Stress Calculation Is IdentifiableTechnology & DesignDesign guide
  13. Conductive Adhesive Thermal Resistance: Bondline Area and VoidsTechnology & DesignDesign guide
  14. Solder-Joint Resistance on Ceramic: Bulk Estimate and Current ConstrictionTechnology & DesignDesign guide
  15. Wet Print Volume: Relating Area, Thickness and Paste ConsumptionTechnology & DesignDesign guide
  16. Paste Inventory Reconciliation: Issued, Returned and Unaccounted MassTechnology & DesignDesign guide
  17. Overglaze Edge Lift: Locate the Separation Before Changing the ProcessTechnology & DesignDesign guide
  18. Overcoating Printed Resistors: Measuring Resistance Shift After CureTechnology & DesignDesign guide
  19. Paste-to-Ceramic Interfaces: Thermal Expansion and Adhesion TestsTechnology & DesignDesign guide
  20. Wire-Bond Metallization: Surface Condition Through the Process SequenceTechnology & DesignDesign guide