Engineering Library

Practical guidance for ceramic circuits, materials, manufacturing and design.

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Technical resources
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All engineering resources

Technical resources for substrate selection, manufacturing, applications, design, quality, sourcing, and supporting documentation.

668
  1. Choosing a model that matches sink and source footprintsTechnology & DesignDesign guide
  2. Choosing functional datums rather than convenient external edgesTechnology & DesignDesign guide
  3. Choosing an interface measurement before material substitutionTechnology & DesignDesign guide
  4. Choosing the minimum inputs for a specific circuit decisionTechnology & DesignDesign guide
  5. Gap as an electric path distinct from heating pitchTechnology & DesignDesign guide
  6. One-dimensional conduction limit versus lateral spreadingTechnology & DesignDesign guide
  7. Air path, surface path and solid insulation kept separateTechnology & DesignDesign guide
  8. Hole stress concentration and neighboring load pathsTechnology & DesignDesign guide
  9. Current constriction at transitions and terminal entriesTechnology & DesignDesign guide
  10. Three-Point Ceramic Reference Planes: Control Extrapolation SensitivityTechnology & DesignDesign guide
  11. Damage allowance separate from dimensional toleranceTechnology & DesignDesign guide
  12. Bulk bond-line conduction versus contact resistanceTechnology & DesignDesign guide
  13. Van der Pauw Coupons: Extract Sheet Resistance Without Counting SquaresTechnology & DesignDesign guide
  14. Sensitivity of resistance to dimension uncertaintyTechnology & DesignDesign guide
  15. Regression confidence interval for end contributionTechnology & DesignDesign guide
  16. Heater Pattern Pitch: Estimate How Spatial Temperature Ripple Decays with DepthTechnology & DesignDesign guide
  17. Worst-case exposed land after component displacementTechnology & DesignDesign guide
  18. Accessible bonding envelope from tool and fixture clearancesTechnology & DesignDesign guide
  19. Remaining functional clearance after chip and location allowancesTechnology & DesignDesign guide
  20. Ceramic Thermal Gaps Under Vacuum: Identify the Pressure-Sensitive PathTechnology & DesignDesign guide