Engineering Library

Practical guidance for ceramic circuits, materials, manufacturing and design.

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Technical resources
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Engineering design guides

Technical resources for substrate selection, manufacturing, applications, design, quality, sourcing, and supporting documentation.

100
  1. Fired Overglaze Windows: Coverage, Pad Access and Edge DefinitionTechnology & DesignDesign guide
  2. Polymer Overcoats: Cure Compatibility and Masking for ConnectionsTechnology & DesignDesign guide
  3. AlN Substrate Thickness: Thermal Benefit and Mechanical Trade-OffTechnology & DesignDesign guide
  4. Solderable Thick Film Terminations: Wetting Area and Joint VolumeTechnology & DesignDesign guide
  5. Glass Phase in Thick Film Layers: Adhesion and Residual StressTechnology & DesignDesign guide
  6. Paste Recovery Measurements: Wall Slip, Pre-Shear and ComparabilityTechnology & DesignDesign guide
  7. Paste Container Warm-Up: Dew Point and Opening ReadinessTechnology & DesignDesign guide
  8. Firing Compatibility: Building a Cumulative Thermal BudgetTechnology & DesignDesign guide
  9. Wet Print Volume: Relating Area, Thickness and Paste ConsumptionTechnology & DesignDesign guide
  10. Overcoating Printed Resistors: Measuring Resistance Shift After CureTechnology & DesignDesign guide
  11. Paste-to-Ceramic Interfaces: Thermal Expansion and Adhesion TestsTechnology & DesignDesign guide
  12. Wire-Bond Metallization: Surface Condition Through the Process SequenceTechnology & DesignDesign guide
  13. Conductive Epoxy Joints: Bondline Control and Dispense VariationTechnology & DesignDesign guide
  14. Solder Joints on Ceramic: Expansion Mismatch and Strain ReliefTechnology & DesignDesign guide
  15. Refiring Thick Film Circuits: Resistance Drift and Layer CompatibilityTechnology & DesignDesign guide
  16. Thermal Shock Testing: Transfer Time and Specimen TemperatureTechnology & DesignDesign guide
  17. Humidity-Bias Measurements: Separating Surface Leakage and RecoveryTechnology & DesignDesign guide
  18. Electrochemical Migration: Contamination, Bias and Electrode SpacingTechnology & DesignDesign guide
  19. Surface Profilometry: Choosing the Step, Scan and Filtering MethodTechnology & DesignDesign guide
  20. Cross-Section Microscopy: Sampling Location and Preparation ArtifactsTechnology & DesignDesign guide